Siemens Aktiengesellschaft

Herbert Vogt

Werner Egerbacher

Dieter Wunderlich

Christian Wengler

Werner Mitzkus

Lothar Wassill

Semiconductor module, including a metallic bottom plate, at least two semiconductor bodies disposed on the bottom plate, at least one of the semiconductor bodies being a thyristor tablet having at least one control electrode, a frame having an inner surface, the frame being connected to the bottom plate and surrounding the semiconductor bodies, at least one control line for each thyristor tablet having first and second sections, each of the first sections being firmly connected to a respective one of the control electrodes and having an end facing away from the one control electrode, the ends each being adjacent the inner surface of the frame and including a contact region, each of the second sections being mechanically connected to the frame and having a contact region in contact with the contact region of a respective one of the first sections, and the second sections each including a contact terminal accessible from outside the module.

Semiconductor module

A disk-shaped housing for a semiconductor element comprising a cup (1) of insulating material with an opening (2) at the bottom. Through this opening (2) passes a contact surface (4) of one of two plate type connecting bodies (3), between which lies a pressure-contacted semiconductor body (14). Both connecting bodies (3, 5) comprise radially and axially oriented seal surfaces (8, 9; 11, 12), against which there abuts under pressure an elastic ring (13) which surrounds the semiconductor body. The cup is filled with sealing compound (18); the semiconductor body is thus protected against penetration of the sealing compound.

Semiconductor element with disk-shaped housing

Pass through having a glass part disposed in an opening formed in a metal case part, an insulator for lengthening the leakage path connected at an end face thereof to at least one end face of the glass part and at least one electric conductor extending through the glass part and the insulator, the connection between the insulator and the glass part including a fused glass junction.

Glass pass through with an additional insulator for lengthening leakage

Housing for a semiconductor device includes a housing cup in which the semiconductor device is disposed, the housing cup has a bottom, at least one wall and a metal plate disposed opposite the bottom. The metal plate is thermally connected to the semiconductor device and has a mounting surface connectible to a heat sink and a lateral surface perpendicular to the mounting surface. Contacts extend from inside the housing cup through the bottom and are firmly connected thereto. Cutouts are formed in the metal plate at the edges thereof opposite said contacts. The mounting surface of the metal plate extends beyond the wall opposite the bottom. The housing is fillable with sealing compound through the cutouts to an extent where at least part of the lateral surface of the metal plate is wetted with sealing compound.

Housing for semiconductor device

A controllable semiconductor component element has a housing of two massive metal bodies, each of which has a flange which is axially and radially embraced by an insulating ring. A semiconductor element is mounted between the metal bodies and has a cathode side and an anode side carrying a cathode and an anode, respectively which are conductively connected, with respect to heat and current, to the respective metal bodies. The anode is in the form of a ring which circumscribes a control electrode. A lead is connected to the control electrode and extends through an axial opening in the cathode side metal body to the exterior for connection, by way of spring tension, solder or the like to a control lead. The opening is completely filled with an insulating material to center and rigidly fix the lead therein. Each of the metal bodies is conically shaped, tapering away from the semiconductor element, and includes a rounded end to be received in a pressure spring.

A controllable semiconductor component having massive heat dissipating

The present invention is directed to a semiconductor device incorporating a semiconductor element which is provided with a housing having at least a base member, a top member and an insulator member which connects the base and top members, the housing having enclosed within it a semiconducting element which is clamped in place between two electrodes by means of at least one spring, the semiconducting element being electrically connected to the electrodes by a thin layer of soft solder, the semiconductor device being provided with a current supply lead which is in contact with at least one of the exterior faces of the housing.

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Munich, Germany

Herbert Vogt