Chroma Ate Inc.

Chruma Ate Inc.

Herbert Tsai

James E Hopkins

Michael Peter Costello

Ching-Too Chen

Chien-Ming Chen

Chin-Yi Ou Yang

A test system with rotational test arms for testing semiconductor components includes a transport device, a first test socket, a second test socket, a first test arm, and a second test arm. The first test socket and the second test socket are electrically connected to different test signals respectively and correspond to the first test arm and the second test arm. The first test arm and the second test arm test arms operate rotationally to carry and place the semiconductor components to the transport device, the first test socket and the second test socket, so the test time is improved.

Test system with rotational test arms for testing semiconductor components

A method for testing System-In-Package (SIP) devices each having a plurality of electrical contacts is described. The method and apparatus utilizes industry standard JEDEC trays and tests at least a predetermined portion of all devices in such trays at the same time.

Method for testing system-in-package devices

Apparatus for testing System-In-Package (SIP) devices each having a plurality of electrical leads is described. The apparatus utilizes industry standard JEDEC trays and tests at least a predetermined portion of all devices in such trays at the same time. The apparatus comprises a test hive comprising: a plurality of test circuits corresponding in number to at least a predetermined number of cells in the tray; and a plurality of groups of test contacts, each group is coupled to one of the test circuits and is oriented to engage the plurality of electrical contacts of a SIP device disposed in a corresponding one of the cells. The test hive is operable to simultaneously, electrically test at least a predetermined number of the number of the SIP devices in each tray engaged by the hive without removing the SIP devices from the tray. The apparatus also includes a sorter automatically operable to remove each SIP device that did not pass electrical testing with SIP devices that did pass electrical testing until a tray of electrically tested SIP devices is fully populated with SIP devices that did pass electrical testing.

Apparatus for testing system-in-package devices

Apparatus for testing System-In-Package (SIP) devices each having a plurality of electrical contacts is described. The apparatus comprises a JEDEC standard tray receiving apparatus comprising a plurality of tray aligners to align the tray into a predetermined position to account for dimensional tolerances of the tray. The apparatus further comprises a test assembly proximate the tray receiving apparatus. The assembly comprises; a plurality of test circuits corresponding in number to the number of cells in the tray, a plurality of groups of test contacts, each of group of the test contacts being coupled to one of the test circuits and being oriented to engage a plurality of electrical contacts of a SIP device disposed in a corresponding one of the cell, the plurality of test circuits being operable to simultaneously, electrically test a predetermined number of SIP devices in a JEDEC standard tray engaged by the receiving apparatus without removing the SIP devices from the tray.

Apparatus for testing micro SD devices each having a plurality of electrical leads is described. The apparatus utilizes industry standard JEDEC trays and tests all devices in such trays at the same time. The apparatus comprises a test hive comprising: a plurality of test circuits corresponding in number to at least a predetermined number of cells in the tray; and a plurality of groups of test contacts, each group is coupled to one of the test circuits and is oriented to engage the plurality of electrical contacts of a micro SD device disposed in a corresponding one of the cells. The test hive is operable to simultaneously, electrically test at least a predetermined number of the number of the micro SD devices in each tray engaged by the hive without removing the micro SD devices that did pass electrical testing until a tray of electrically tested micro SD devices is fully populated with micro SD devices that did pass electrical testing.

Test circuits of an apparatus for testing micro SD devices

Apparatus for testing System-In-Package (SIP) devices each having a plurality of electrical leads is described. The apparatus utilizes industry standard JEDEC trays and tests all devices in such trays at the same time. The apparatus of the illustrative embodiment comprises a test hive comprising: a plurality of test circuits corresponding in number to the number of cells in the tray; and a plurality of groups of test contacts, each of the groups of the test contacts being coupled to one of the test circuits and being oriented to engage the plurality of electrical contacts of SIP device disposed in a corresponding one of the cells, the test hive being operable to simultaneously, electrically test all of the SIP devices in each tray engaged by the hive without removing the SIP devices from the tray.

Test circuits of an apparatus for testing system-in-package devices

A method and apparatus for testing micro SD devices each having a plurality of electrical leads is described. The method and apparatus utilizes industry standard JEDEC trays and tests all devices in such trays at the same time.

Method for testing micro SD devices using test circuits

A method for testing System-In-Package (SIP) devices such as micro SD devices each having a plurality of electrical leads is described. The method utilizes industry standard JEDEC trays and tests all devices in such trays at the same time.

Method for testing plurality of system-in-package devices using plurality of test circuits

A method for testing micro SD devices each having a plurality of electrical leads is described. The method utilizes industry standard JEDEC trays and tests at least a predetermined portion of the devices in such trays at the same time. The method of the illustrative embodiment include the steps of: providing a test hive comprising a plurality of test circuits corresponding in number to at least a predetermined portion of said cells and comprising a plurality of groups of test contacts, each group of said groups of test contacts being coupled to one of said test circuits and being oriented to engage said plurality of electrical contacts of a micro SD device disposed in a corresponding one of said cells; moving each said tray from said stack one at a time to a position proximate said test hive; causing relative movement of said tray proximate said test hive whereby said test hive engages said tray of micro SD device and said test hive such that electrical connection is made simultaneously by each of said groups of test contacts with said electrical contacts of a micro SD device disposed in said corresponding of said cells; and simultaneously, electrically testing at least a predetermined portion of said micro SD devices in each tray engaged by said hive without removing said micro SD devices from said tray.

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Kaohsiung, Taiwan

Herbert Tsai