Ev Group Gmbh

Ev Group E. Thallner Gmbh

Herbert Tiefenböck

Jürgen Burggraf

Daniel Burgstaller

Stefan Pargfrieder

Wolfgang Tiefenböck

A chuck for clamping workpieces or tools in a clamping space with a clamping force (F). The chuck includes at least two chuck jaws movable in translation along one clamping plane (E) in the direction of one center Z of the clamping space and a gear train located at least largely within the chuck for transfer of a driving torque of a drive motor, which can be coupled to the gear train by coupling means of the gear train, to the chuck jaws for movement of the chuck jaws. The coupling means able to be coupled to a corresponding coupling connection of the drive motor. The movement from the maximum size of the clamping space to the minimum size of the clamping space is executed via the gear train from the drive motor.

Chuck adapted for automated coupling

A mounting apparatus for handling of a structured substrate which has structures. The mounting apparatus having a soft material layer for accommodating the structured substrate on a receiving surface. The structures of the structured substrate are able to be taken at least partially into the material layer. Fixing means for fixing of the structured substrate on the receiving surface are provided.

Receiving device for handling structured substrates

A workpiece accommodation device for purposes of accommodating a workpiece and for use in a device for the machining of a workpiece with: a tool mounting for purposes of accommodating the tool, a workpiece accommodation device for purposes of accommodating the workpiece, characterized in that during the machining process at least one first oscillation component can be introduced in a Z-direction, and an, in particular simultaneous, second oscillation component can be introduced in an X- and/or Y-direction by means of oscillation components.

System and method for machining a workpiece

A workholding fixture for holding flat semiconductor substrates with

Receiving device for receiving semiconductor substrates

A workpiece holding fixture for receiving a workpiece and for use in a device for the machining of a workpiece with: a tool holding fixture for receiving the tool, a workpiece holding fixture for receiving the workpiece, characterized in that, during the machining, at least one first oscillation component in a Z-direction and a second, in particular simultaneous, oscillation component in the X- and/or Y-direction can be introduced by means of oscillation components.

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Andorf, Austria

Herbert Tiefenböck