Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Other

Technische Universitaet Berlin

Technische Unversität Berlin

Herbert Reichl

Elke Zakel

Ghassem Azdasht

Heinrich Meyer

Klaus-Dieter Lang

Klaus Lang

Wolfgang Scheel

Stefan Fiedler

Dieter Oesterhelt

Joachim Kloeser

Ute Geissler

Martin Schneider-Ramelow

Jurgen Wolf

Holger Gaul

Stefan Weib

Eberhard Kaulfersch

Manfred Topfer

Gunter Engelmann

Jürgen Wolf

A device for continuous measurement of the forces acting upon a movable compressible playable object is provided with at least one transmitter communicating with at least one receiver outside the movable object. The at least one receiver transforms signals received and evaluates them online. The movable compressible playable object, for instance a ball, includes at least one pressure sensor and/or at least one three-dimensional acceleration sensor as well as a converter for transforming signals therefrom to transmit them to the transmitter. A method for the use of this device causes activation of the transmitter in the movable object so that a system is created for the measurement of the forces acting upon such an object wherein the received measuring signals are present in evaluated form, online or offline, to be analyzed. By means of the activation method, the active sensor system is initiated to receive and transmit measuring signals.

Stand-alone miniaturized communication module

A method for generating a wire bond between a wire and an electrical contact member is provided. The method comprising the steps of: pressing a first surface of a portion of the wire against a second surface of the electrical contact member with a first force while vibrating the portion of the wire along the second surface in order to generate a bond; measuring the time dependent vibration amplitude of the portion of the wire at a number of discrete time steps during the generation of the bond; measuring the time dependent deformation of said portion of the wire due to said applied first force and said vibration at a number of discrete time steps during the generation of the bond; and generating a time dependent first signal from at least said vibration amplitude and said deformation at a number of discrete time steps during the generation of the bond that is a direct measure of the stability of the bond at the respective time step.

Method and device for controlling the generation of ultrasonic wire bonds

Method for thermally bonding contact elements ( ) of a flexible film substrate ( ) to contact metallizations ( ) of an electronic component ( ), the flexible film substrate having a support layer ( ) of transparent plastics material and energy being applied to the contact elements from their rear by means of laser radiation ( ), the transparency of the support layer ( ), the absorption of the contact elements ( ) and the wavelength of the laser radiation ( ) being matched to one another in such a way that the laser radiation is essentially transmitted through the support layer ( ) and absorbed in the contact elements ( ), and the pressure being applied to the substrate ( ) in such a way that the contact elements ( ) of the substrate ( ) and the contact metallizations ( ) of the component ( ) are up against one another during the application of the laser radiation ( ) in the region of an application point of the optical fibre.

Method for bonding a flexible substrate to a chip

The invention relates to the production of thin metal layers and structures thereof on substrates of various structures. The lateral extent of a metal layer on the respective substrate can be prescribed with a precision in the micron and submicron range. The method described makes it possible to manufacture flat and three-dimensional metal structures on smooth planar or curved surfaces, as are required, for example, for depicting writing or drawings. The method uses no printing techniques.

Method to prepare the production of structured metal coatings using proteins

Chip housing

A chip arrangement has a first chip, a connecting device and at least a second chip or a substrate. The connecting device has a plurality of individual, spaced diamond parts which are arranged between the chips or between the first chip and the substrate and are connected to these such that the chips or the chip and the substrate are connected together via the diamond parts only. Methods for producing a chip arrangement of this kind comprise either the application of a diamond layer over the whole surface of the substrate and the subsequent structuring of the diamond layer to define individual, spaced diamond parts or the application of individual diamond parts to either the first chip or the second chip or the substrate such that they are arranged in spaced relationship with one another. The individual, spaced diamond parts are subsequently connected to the other component which is to be connected such that they are connected via the diamond parts only. A method of this kind is particularly suitable for connecting a high-power chip to a heat sink.

Chip arrangement and method of producing the same

Method of flux-free contacting of components on a substrate, having the following process steps:

Flux-free contacting of components

Growing community of inventors

Berlin, Germany

Herbert Reichl