Siemens Aktiengesellschaft

Herbert Prussas

Ferdinand Frenkel

Lothar Rapp

Lothar Spaeter

Franz Taumberger

Detlef Haberland

Helmut Haltenorth

Michael Kaindl

Michael Langenwalter

Peter Stern

Rudolf Falkenstein

Karl H Moehrmann

Bernhard Buselmeier

A heat dissipating housing (W/Gl/G) for a circuit component (IC) consists of at least one bottom tub (G) and a cover (W) having a planar cover face. A frame-shaped portion of this cover face serves as a bearing surface (TF) for meeting a planar bearing surface (TF) of the sidewalls (G1) of the bottom tub (G). Both bearing surfaces (TF) are finally fastened together. At least parts of the cover's outside surface (W) are cooled in operation by a cooling medium (KL), dissipated heat being conveyed from the circuit component (IC) via a stiff heat conducting body (SC1, SC2) and a good heat conductor element consisting of elastic material (FE/WS/WL) to the cover (W). In each instance, at least one good heat conductor spring structure (WL/WS) with feather tongues (WL) is inserted in lateral gaps between the heat conducting body (SC1, SC2) and at least two of the sidewalls (G1) of the bottom tub (G) in an expanding manner by means of its feather tongues (WL) so that these spring structures (WL/WS) adhere through friction forces. The element (FE) and the spring structures (WS/WL) are formed as a cohering spring unit (Fe/WL/WS) from a single piece of spring plate with a center part (FE) and side parts (WS). The good heat conductor cover (W) is connected with the center part (FE) firmly and heat conductingly. Centering retention of cover (w) by the spring unit inhibits displacement of cover (w) relative to the sidewalls.

Heat dissipating housing for a circuit component

A heat dissipating housing (1, 4, 5, 6) with a tub (1, 4) and an outer cover (5, 6) seated on the tub (1, 4)--preferably hermetically tight--for an electronic circuit component (11, 17) which in operation gives off heat to be dissipated such as a light emitting diode (17) and/or a semiconductor driver chip (11) is disclosed. The circuit component (11, 17) is fastened on the bottom (1) of the tub (1, 4). In operation, the heat to be dissipated is to be transferred at least in considerable part via a heat removal body (5, 6) of the housing (1, 4, 5, 6) to an outer surface of the housing, preferably via a heat conducting outer cover (5, 6) serving as the heat removal body (5, 6) to the outer surface air, sweeping the housing. The dissipated heat removal to the cooling medium is improved by especially simple means in that at least a part of the inner surface of the bottom (1) as well as of the sidewalls (4) of the--on the whole--relatively poorly heat conducting tub (1, 4) is lined with at least one lining sheet (2) of good heat conduction, the lining sheet (2) having a transitional section of good heat conduction toward the circuit component (11, 17) as well as toward the heat removal body (5, 6).

Heat dissipating housing for an electronic component

A housing for an optoelectronic circuit module useful in a glass fiber communications system including a luminous flux suspended into the housing. The flux is conducted in a vacuum or a gas, between first and second mutually positioned optical components. The first optical component is attached to the housing via a first support, and a second optical component is attached to the housing via a second support. The first support is installed in one of the housing walls or inside the housing and the second support is rigidly attached to an interior section of the housing. In operation, at least the second support is subjected to large temperature variations of e.g., between -40.degree. C. and +130.degree. C. At least the interior section of the housing which is adjacent to the second support is comprised of a first weldable material and has a first linear thermal expansion coefficient. At least a portion of the second support which is adjacent to the interior section of the housing is comprised of a second weldable material which has a second linear thermal expansion coefficient which differs from the first expansion coefficient. Installed inside the housing is at least one electronic component, e.g., an infrared light-emitting diode which, during operation, produces increases in temperature inside the housing due to waste heat. The second support is located adjacnet to the interior section of the housing, but is welded via only a comparatively small point-like spot to the interior section.

Housing for an optoelectronic circuit module

A glass fiber bushing is provided for a wall opening of a housing which has a light-transmitting or a light receiving component mounted therein, the component having an optically-active location to be optimally coupled to the tip of the glass fiber. At least in the region of the opening through the housing, the glass fiber is firmly surrounded by and is secured in a stiff tube which is inserted through the wall opening. An adjustment member which adjusts the glass fiber position is slipped with a tight clearance over the tube and/or over a transition piece which is secured to the tube. An end face of the adjustment member is oriented toward the exterior surface of the housing in the region surrounding the wall opening. At least close to the tip of the glass fiber, the outer diameter of the glass fiber or of a glass fiber protective layer is surrounded by the inner wall of the tube with so little play that the tube defines the position of the tip of the glass fiber. In a region between the adjustment member and the component the tube is plugged through an elastic membrane of the wall opening. A surface of the membrane is secured to the housing in the area of the wall opening. The end face of the adjustment member which adjusts the position of the tube and, therewith, the position of the glass fiber is secured to the exterior surface of the housing.

Glass fiber bushing through a wall opening of a housing and method of

A method for laser-light welding of a metallic base layer to a thin, metallic covering lying thereon, whereby the covering which is highly reflective for the laser light is covered with a metal skin which is less highly reflective for the laser light, namely with a metal skin which noticeably absorbs the laser light. In case both the covering as well as the base layer are wettable with solder metal, the covering highly reflective for the laser light is first covered with a metal skin composed of a solder metal, whereupon said covering is welded to the base layer by means of the laser light.

Method for welding by means of laser light

A housing-free, vertically insertable single-in-line circuit module has a carrier consisting of synthetic film or ceramic which carries a series of metal terminal pins and one or more electrical components including at least one integrated semiconductor circuit element, and associated conductor runs connecting the circuit element to the terminals, and the carrier has one lateral face thereof which is substantially covered by a metallic cooling sheet for permitting improved cooling of the circuit module by convection.

Housing-free vertically insertable single-in-line circuit module

A protective tube arrangement particularly useful for positioning the end of a glass fiber relative to an opto-electronic component of a module having a housing, which housing engages the protective tube characterized by the glass fiber being secured to the tube at two axially spaced locations with the length of the fiber extending between the two locations and the distance of the tube between the locations being selected so that the fiber has a greater length than the distance for all temperatures below a maximum temperature limit. Thus, the fiber is not subjected to tensile stresses and the distance between the two locations on the tube and the length of the fiber are selected so that the compressive stresses are below 1 N/mm.sup.2 for all temperature ranges between the maximum temperature limit and the minimum temperature limit. The method for securing the fiber in the tube can either be by forming both connections simultaneously or in sequence but forming them at a temperature greater than the maximum temperature limit so that after forming the connection and cooling to the maximum temperature limit or therebelow, the fiber between the two connecting locations will not be subjected to tensile stresses.

Protective tube arrangement for a glass fiber

A common housing for two semi-conductor bodies is provided, comprising a front and back section for two spatially separate semi-conductor bodies attached in the housing interior but preferably connected in electrically conductive fashion to one another, whereby the housing surface preferably composed entirely of metal is cooled during operation by a flowable coolant, preferably cooling air. The front, first semi-conductor body is attached in the front section thereof and the back, second semi-conductor body is attached in the back section thereof, the maximum operating temperature of the back semi-conductor body being higher than the maximum operating temperature of the front semi-conductor body, at least at times. The thermal resistance between the front semi-conductor body and a front thermally conductive cooling surface as well as the thermal resistance between the back semi-conductor body and a back thermally conductive cooling surface differing from the front cooling surface, being respectively lower than both the thermal resistance in the housing interior between the two semi-conductor bodies as well as the thermal resistance between the front and the back cooling surface. During operation, the coolant first flows past the front cooling surface and subsequently flows past the back cooling surface.

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Reichertshausen, Germany

Herbert Prussas