E.i. Dupont De Nemours and Company

Herbert L Fritz

Daniel D Johnson

A conductive through-hole hole is formed by through a dielectric sandwiched between conductors forming a noncircular hole in a conductor, etching a hole through the dielectric and by deforming at the conductor which has been undercut during the etching.

Article containing conductive through-holes

An improved process is disclosed for forming a series of electrically conductive path through-holes in a dielectric layer which is sandwiched between two electrically conductive layers by applying pressure to conductive overhangs in a conductive layer through and elastomeric surface.

Method for forming electrically conductive paths through a dielectric

A conductive through-hole hole is formed through a dielectric sandwiched between conductors by forming a noncircular hole in a conductor, etching a hole through the dielectric and by deforming at the conductor which has been undercut during the etching.

Process for forming conductive through-holes through a dielectric layer

Process for preparation of printed circuits by applying particulate metal to tacky image areas, optionally removing excess particulate metal, and contacting the metallized image areas with an aqueous solution comprising cations of a plating metal to accomplish a metal-metal ion displacement reaction, the solution being substantially free of any chemical reducing agent for said cations. Preferably the conductive circuit is electroplated or soldered.

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Englishtown, NJ, United States of America

Herbert L Fritz