Medos International Sarl

Ethicon, Gmbh

Codman & Shurtleff, Inc.

Alusuisse Technology & Management Ltd.

Sy & Se Sa

Coat-X Sa

Ecole D'ingénieurs Arc

Cartier International Ag

Integra Lifesciences Switzerland Sarl

Haute Ecole Arc Ingénierie

Herbert Keppner

Juergen Burger

Thierry Aellen

Andreas Hogg

Yanik Tardy

Foster B Stulen

Timothy G Dietz

William D Dannaher

Sora Rhee

William A Olson

John W Willis

Jean-Paul Sandoz

Walter Hotz

Rudolf Buser

Philippe Margairaz

Sébastien Brun

Robert Lockhart

Frank Zumkehr

Franz Friedrich

Danik Brand

Jerome Charmet

Mustapha Benkhaïra

Michael Goetz

Florian Telmont

Sophie Farine

The invention relates to a method for adhesion of a thin film or functional layer to a substrate by applying a pulsed and/or alternating voltage.

Promoting adhesion of thin films

Implantable medical devices, and methods of coating same, including a plurality of components disposed on a substrate, and a low surface energy layer deposited as a liquid over at least a first portion of the components and the substrate, the low surface energy layer becoming solidified after deposition and conforming to at least the first portion of the components. The devices further include a biocompatible hermetic coating conforming to and sealingly covering at least a portion of the low surface energy layer.

Three dimensional packaging for medical implants

Ultrasound surgical apparatus are disclosed, including: medical ultrasound handpieces with proximally mounted ultrasound radiators configured to create a distally-focused beam of ultrasound energy, in combination with distal guide members for control of focal point depth; medical ultrasound handpieces with proximally mounted ultrasound radiators configured to create a distally-focused beam of ultrasound energy, in combination with distal rolling members for manipulability and control of focal point depth; medical ultrasound handpiece assemblies with coupled end effectors providing a probe with a probe dilation region configured to have an average outside diameter that is equal to or greater than the average outside diameter of a probe tip and neck; as well as junctions to an ultrasonically inactive probe sheath; medical ultrasound handpiece assemblies with coupled end effectors having positionable, ultrasonically inactive probe sheath ends slidably operable to both cover and expose at least a probe tip; and ultrasound transducer cores including a transducer structure affixed to a longitudinally elongated, generally planar, single crystal or polycrystalline material waveguide.

Ultrasonic surgical apparatus with silicon waveguide

An implantable medical device including a plurality of components on a substrate, and a biocompatible multi-layer coating applied at least in part by vapor deposition to conform to and sealingly cover at least a portion of the components and/or the substrate. The coating is applied in at least two sets of layers, wherein each set has at least one layer formed by dissociation of a polymeric precursor and then deposition of that precursor, and another layer is a biocompatible liquid.

Packaging with active protection layer

An implantable medical device including a plurality of components on a substrate, and a biocompatible multi-layer polymeric coating applied by vapor deposition to conform to and sealingly cover at least a portion of the components and/or the substrate. The coating is applied in at least two pairs of layers, wherein each pair has one layer formed by dissociation of a precursor and then simple deposition of that precursor, and the other layer is formed by at least one of plasma dissociation and excitation of the precursor to form a plasma-enhanced precursor, and then deposition of the plasma-enhanced precursor.

Plasma enhanced polymer ultra-thin multi-layer packaging

An implantable medical device including a plurality of components on a substrate, and a biocompatible multi-layer coating applied by vapor deposition to conform to and sealingly cover at least a portion of the components and/or the substrate. The coating is applied in at least two sets, each set having first, second and third layers. At least one of the first, second and third layers consist essentially of a polymer such as parylene and at least one of the other two layers of the set consist essentially of inorganic material such that each layer differs in at least one diffusion barrier property from the other layers in the set and adds to an overall barrier effect of the coating.

Ultra-thin multi-layer packaging

A method for producing a membrane device by providing a substrate (), adding a liquid () thereon, and covering the liquid () and at least one substrate portion bearing the liquid () with a homogenous continuous thin film () by means of a low-pressure deposition process. The film is made of a plastic material and forms a membrane.

Method for producing a plastic membrane device and the thus obtained device

A thermal flow sensor has a first, second and third substrate, each having a first side and a second opposite side. The first substrate is connected to the second substrate such that the second side of the first substrate abuts the first side of the second substrate. The third substrate is connected to the second substrate such that the second side of the second substrate abuts the first side of the third substrate. The second substrate has a groove formed therein so as to form a conduit bounded by the second substrate and the second side of the first substrate and the first side of the third substrate. A heater is disposed on the first side of the first substrate opposed to the conduit. A first temperature sensor is disposed on the first side of the first substrate opposed to the conduit. A second temperature sensor is disposed on the first side of the first substrate opposed to the conduit. A first recess is formed in at least one of the first side and the second side of the first substrate between the heater and one of the first temperature sensor and the second temperature sensor.

Thermal flow sensor having recesses in a substrate

Coating substrate

Growing community of inventors

Colombier, Switzerland

Herbert Keppner