Hewlett-packard Development Company, L.p.

Hewlett-packard Company

Hewlett Packard Enterprise Development LP

Herbert J Tanzer

Brian S Tsuyuki

Darrel W Poulter

Andrew Michael Cherniski

James J deBlanc

Everett R Salinas

Ralph M Tusler

Henry Jupille

Kenneth K Tang

Richard B Nelson

Alicia G Mercer

Pete Capano

Barry J Oldfield

Peter Gysling

Kenneth T Small

David Dickey

David Johannes Pommerenke

Richard G Sevier

Carl R Haynie

Kwang Ho Kim

James L Dowdy

Jon Anson

Michal P Warzecha

Mohammad M Bari

Khosrow Zardkoohi

Tanya Schneider

Timothy M Sheridon

Reino E Hautala

Example drive cage panels for drive cages are disclosed. For example, a drive cage panel for a drive cage may include a plurality of air inlet holes in a front face of the drive cage panel, a plurality of air guides through a surface of the drive cage panel, the plurality of air guides aligned with a drive region of the drive cage, and an air baffle. In one example, the air baffle is to divert a flow of air from the plurality of air inlet holes to the drive region via the plurality of air guides when deployed on the surface of the drive cage panel.

Drive cage panels to divert flows of air

A channel is created within a planar layer. At least a portion of an optical path is formed within the channel. An optical core medium may be deposited into the channel. In various embodiments, reflective layers are deposited within and over the channel to form the optical path. In another embodiment, a photosensitive sheet is exposed to an optical path mask in the presence of an optical source to define an optical path lying within the plane of the sheet.

Planar layer with optical path

In one embodiment, a removable storage module for use in a module cage includes a latch mechanism including: a latch arm that is used to rotate the mechanism about an axis, and a top portion that includes at least one latch tooth and a paddle member, the latch tooth comprising a first surface that is adapted to abut a rear side of a first flange of the cage during insertion of the module and a second surface that is adapted to abut a second flange of the cage during removal of the module, the paddle member being adapted to abut a front side of the first flange during removal of the module.

Removable storage modules

An optical cross connect includes first and second planar layers having m and n optical path(s), respectively. An optical switch array comprising a plurality of optical switches is disposed to enable optically coupling any optical path of the first planar layer with any optical path of the second planar layer. Techniques for creating a variety of optical path types are provided.

Methods and apparatus for selectively coupling optical paths

In one embodiment, a removable storage module includes a bezel, and opposed first and second rails that extend from the bezel, the first rail including a key system component that is adapted to prevent full insertion of the module into a bay of a module cage so as to protect a connector of at least one of the module and the cage. In another embodiment, a removable storage module for use in a module cage includes a latch mechanism including: a latch arm that is used to rotate the mechanism about an axis, and a top portion that includes at least one latch tooth and a paddle member, the latch tooth comprising a first surface that is adapted to abut a rear side of a first flange of the cage during insertion of the module and a second surface that is adapted to abut a second flange of the cage during removal of the module, the paddle member being adapted to abut a front side of the first flange during removal of the module.

A method of forming an optical communication path includes forming an optical path for carrying optical communications. An electrically conductive cladding is formed along the optical path for carrying at least one of electrical power, control, and data along the optical path.

Optical path with electrically conductive cladding

Systems for mounting data storage devices to a chassises are provided. A representative system includes a filler carrier that incorporates a bezel. The bezel including a first snap configured to move between a latched position and an unlatched position. In the latched position, the snap facilitates secure mounting of the filler carrier to a chassis by forming an interference fit with the chassis. In the unlatched position, the snap facilitates removal of the filler carrier from the chassis. The bezel of the filler carrier can be formed as a monolithic structure. Other systems and devices also are provided.

Systems for use with data storage devices

Systems and methods for protecting electronic devices from electrostatic discharge are provided. A preferred system includes a module configured to be received by an enclosure. The module incorporates an electronic component, such as a memory device, processor, and/or circuit assembly, for example, that is configured to electrically communicate with at least a portion of the enclosure when the module is received by the enclosure. The module also includes a first contact portion that is arranged to contact the enclosure as the module is received by the enclosure. Preferably, the first contact portion is formed, at least partially, of a dissipative material. So configured, when the first contact portion engages the enclosure, an electrostatic charge of the module may be discharged in a controlled manner. Methods also are provided.

Systems with enhanced electrostatic discharge protection

Data storage systems are provided. A representative system includes a carrier that incorporates a frame and a cover. The frame includes a faceplate, a first rail and a second rail, with the first and second rails extending outwardly from said faceplate. The first and second rails also are adapted to receive the cover therebetween. Preferably, the cover is configured to at least partially encase a data storage device received by the carrier. Other systems and devices also are provided.

Mounting of data storage devices with compliant storage module covers

Data storage systems are provided. A representative data storage system includes a chassis that is configured to mount at least one data storage device and a carrier. The carrier incorporates a frame and a handle assembly. The frame includes a first and second rails that are spaced from each other and configured to engage opposing sides of a data storage device. Preferably, the first and second rails are formed at least partially of metal for dissipating heat from the data storage device. The handle assembly includes a handle that is configured to move between a latched position and an unlatched position. In the latched position, the handle facilitates secure mounting of the carrier to the chassis. In the unlatched position, the handle facilitates removal of the carrier from the chassis. Other systems and devices also are provided.

Data storage systems with enhanced cooling

Data storage systems are provided. Preferably, a data storage system includes a chassis and a carrier. The chassis is configured to mount at least one data storage device. The carrier incorporates a housing and a handle assembly. The housing is configured to receive at least a portion of a data storage device. The handle assembly includes a handle that facilitates secure mounting of the carrier to the chassis and removal of the carrier from the chassis. Other systems and devices also are provided.

Systems for mounting data storage devices

Systems for mounting electronic components are provided. An exemplary system includes a module that is configured to mount to a chassis at a first pitch. The module incorporates a housing, which is adapted to at least partially encase an electronic component, and spring fingers that are arranged at least partially about an exterior of the housing. The spring fingers are configured to deflect in response to a displacement force so that the module can be mounted to a chassis. The module can be mounted to a first chassis that accommodates a predetermined pitch of modules. In some embodiments, the module also can be mounted at a different pitch. Other systems also are provided.

Systems for mounting electronic component modules

Method and system for shielding a circuit board from electrostatic discharge and from mechanical damage. A circuit board shield of dimensions roughly equivalent to those of the circuit board that the circuit board shield is designed to protect is manufactured to contain apertures complementary in shape, size, and position to heat-producing components affixed to the surface of a circuit board. When the circuit board shield is placed on top of the circuit board, the heat-producing components of the circuit board remain exposed to an external environment via the apertures, while other parts of the circuit board are protected from electrostatic discharge and mechanical damage by the overlying circuit board shield.

METHOD AND SYSTEM FOR SHIELDING AN EXTERNALLY MOUNTED CIRCUIT BOARD FROM ELECTROSTATIC DISCHARGE AND MECHANICAL DAMAGE WHILE ALLOWING FOR HEAT EXCHANGE FROM HEAT-PRODUCING COMPONENTS OF THE CIRCUIT BOARD THROUGH THE CIRCUIT BOARD SHIELD INTO AN EXTERNAL ENVIRONMENT

A stabilization mechanism limits rotational vibration in a module enclosure containing plural objects, such as computer disk drives, that produce rotational vibration about a rotational axis. The mechanism includes stabilizer structure coupled to an outer surface of the module enclosure and constructed to transmit a force toward the object that is effective to stabilize the object in the module enclosure. The stabilization mechanism may be formed as first and second spring-loaded contacts that each apply a constant force to the object.

Growing community of inventors

Folsom, CA, United States of America

Herbert J Tanzer