Mcdonnell Douglas Corporation

Cutting Edge Optronics, Inc.

Herbert G Koenig

Louis B Allen, Jr

Robert R Rice

Dana A Marshall

Danny D Meyer

Gordon H Burkhart

Robert A Stacy

A process for manufacturing a laser diode package including a laser diode, a heat sink and a lid. The laser diode has an emitting surface, a reflective surface opposing the emitting surface, and first and second surfaces between the emitting surface and the reflective surface. The laser diode has a diode height defined between the emitting surface and the reflective surface. The heat sink has an interior surface, an exterior surface opposing the interior surface, a top surface and a base surface. The height of the heat sink is defined between the top surface and the base surface and is approximately less than four times the laser diode height. The first surface of the diode is attached to the interior surface of the heat sink with a first solder. The base surface of the heat sink is coupled to a thermal reservoir. The lid is attached to the second surface of the laser diode via a second solder. An upper end of the lid is near the emitting surface of the laser diode. A lower end of the lid is typically slightly below the reflecting surface of the laser diode. The heat sink of the laser diode packages is attached to a backplane which is then connected to a thermal reservoir.

Process for manufacturing a laser diode having a heat sink

A laser diode package includes a laser diode, a heat sink and a lid. The laser diode has an emitting surface, a reflective surface opposing the emitting surface, and first and second surfaces between the emitting surface and the reflective surface. The laser diode has a diode height defined between the emitting surface and the reflective surface. The heat sink has an interior surface, an exterior surface opposing the interior surface, a top surface and a base surface. The height of the heat sink is defined between the top surface and the base surface and is approximately less than four times the laser diode height. The first surface of the diode is attached to the interior surface of the heat sink with a first solder. The base surface of the heat sink is coupled to a thermal reservoir. The lid is attached to the second surface of the laser diode via a second solder. An upper end of the lid is near the emitting surface of the laser diode. A lower end of the lid is typically slightly below the reflecting surface of the laser diode. A plurality of laser diode packages are grouped together to form an array. The heat sink of each of the laser diode packages is attached to a backplane which is then connected to a thermal reservoir.

Laser diode package with heat sink

A laser diode is soldered between metal plates for intimate thermal and electrical contact. The plates are prefabricated and are provided with an insulative spacer therebetween. The two metal plates are held together in a preferred orientation by the spacer which is firmly adhered and sealed to the two plates during the diode soldering operation. The metal plates are constructed from material thin enough that they yield under thermal pressure of the diode to eliminate mechanical strain on the diode during thermal cycling. Backup plates are provided in contact with the diode mounting plates to feed electrical energy thereto.

Laser diode with double sided heat sink

High power operation in conjunction with excellent mode stability is rendered possible by a unique configuration comprising the use of two injection laser diode sections in a crossed-junction configuration.

Mode stable injection laser diode

A laser diode is soldered between metal plates for intimate thermal and electrical contact. The plates are prefabricated and are provided with an insulated spacer therebetween. The two metal plates are held together in a preferred orientation by the spacer which is firmly adhered and sealed to the two plates during the diode soldering operation. The laser diodes so mounted can be tested in this configuration and after testing are formed into an array by stacking the laser diode subassemblies providing spacer elements therebetween and series contacts from one end to the other of the array so that an array of laser diodes with matched characteristics can be constructed in a line which may not be in alignment with the total package to provide an intense light output at a predetermined wavelength.

Heat sink laser diode array

A laser diode suitable for integrated and fiber optic applications requiring single transverse and single longitudinal mode operation. The single transverse mode is provided by making a gallium arsenide double heterostructural laser diode with a narrow stripe width and a relatively long length. The single longitudinal mode operation is provided by cracking the diode transverse to the stripe at one or more locations to form internal etalons in the laser cavity.

Etalon laser diode

An electrooptic crystal having improved characteristics including an improved light extinction ratio and a process of making same including etching certain portions of the lateral surfaces thereof so as to relieve surface and other strain in the crystal.

Growing community of inventors

St. Charles, MO, United States of America

Herbert G Koenig