Lam Research Corporation

Lightwind Corporation

Herbert Elliot Litvak

Gary B Powell

Rajeev Bajaj

Jiri Pecen

Stephen C Jew

Rahul K Surana

John Boyd

Eugene Yuexing Zhao

Kang Jia

Michael David Steiman

Christian David Frederickson

The present invention relates to monitoring chemicals in a process chamber using a spectrometer having a plasma generator, based on patterns over time of chemical consumption. The relevant patterns may include a change in consumption, reaching a consumption plateau, absence of consumption, or presence of consumption. In some embodiments, advancing to a next step in forming structures on the workpiece depends on the pattern of consumption meeting a process criteria. In other embodiments, a processing time standard is established, based on analysis of the relevant patterns. Yet other embodiments relate to controlling work on a workpiece, based on analysis of the relevant patterns. The invention may be either a process or a device including logic and resources to carry out a process.

Method and apparatus for chemical monitoring

The present invention relates to interfacing new sensors to incumbent controls. In particular, it relates to optically interfacing a new sensor, such as a spectrometer with plasma generator, to an incumbent electro-optical sensor. Logic and resources to control activation of the incumbent electro-optical sensor may be included. Particular aspects of the present invention are described in the claims, specification and drawings.

Optical control interface between controller and process chamber

An optical window structure is disclosed. The optical window structure includes a support layer that has a reinforcement layer and a cushioning layer. In addition, the optical windows structure has a polishing pad which is attached to a top surface of the support layer. Furthermore, the optical window structure has an optical window opening and a shaped optical window. The shaped optical window at least partially protrudes into the optical window opening in the support layer and the polishing pad during operation.

Apparatus for accurate endpoint detection in supported polishing pads

An invention is disclosed for end point triggering in a chemical mechanical polishing process. A sensor array is positioned beneath a polishing belt having an end point window. The polishing belt is then rotated during the CMP process, and a transverse position of the end point window is determined based on a portion of the sensor array covered by a particular portion of the polishing belt. The particular portion of the polishing belt can be the end point window, a trigger slot, or a portion of the polishing belt covered by a reflective material. The sensor array can optionally be a charged coupled device (CCD), or a linear array of sensors. In operation, the positional information is determined based on which sensors are covered by the particular portion of the polishing belt. The positional information is then communicated to a belt steering system, which corrects the transverse position of the end point window based on which sensors are covered by the particular portion of the polishing belt.

Method and apparatus for end point triggering with integrated steering

A wafer polishing device with movable window can be used for in-situ monitoring of a wafer during CMP processing. During most of the CMP operation, the window remains below a polishing surface of a polishing device to protect the window from the deleterious effects of the polishing process. When the window moves into position between the wafer and a measurement sensor, the window is moved closer to the polishing surface. In this position, at least some polishing agent collected in the recess above the window is removed, and an in-situ measurement can be taken with reduced interference from the polishing agent. After the window is positioned away from the wafer and measurement sensor, the window moves farther away from the wafer and polishing surface. With such a movable window, the limitations of current polishing devices are overcome.

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San Jose, CA, United States of America

Herbert Elliot Litvak