Samsung Electronics Co., Ltd.

Horiba Stec, Co., Ltd.

New Power Plasma Co., Ltd.

Dandan Co., Ltd.

Heok-Jae Lee

Do-In Bae

Jang-Hyoun Youm

Hyu-Rim Park

Kee-Weone Seo

Chang-Woo Woo

Sang-Ho Kim

Sang-ho Kim

Jun-Won Lee

Yun-sik Yang

Tae-Hoon Lee

Soon-im Wi

Kang-Ho Lee

Ja-Woo Lee

Ichiro Nishikawa

Masanori Terasaka

Sang-Jin Choi

Jung-hyun Cho

Masashi Hamada

Jae-Seok Kim

Hyun-Sik Sim

Sang-jean Jeon

Dong-Ok Shin

Chung-huan Jeon

Kwang-young Jung

Jung-Suk Oh

Sun-uk Kim

Ho-Gon Kim

Hyuk-Yul Choi

Moo-jin Kim

Hyung-Ho Kim

Jang-kyu Choi

A vaporizer includes a main body including a first body and a second body. The first body has an upper portion narrowing in a direction of a height of the first body and the second body has a cavity in which the first body is positioned. A mixing chamber is between the first and second bodies. The second body includes a carrier gas injection path connected to a carrier gas inlet formed in an upper portion of the mixing chamber. The carrier gas injection path carries a carrier gas. A source material injection path is connected to a source material inlet formed in the mixing chamber. The source material injection path carries a liquid source material. A discharge is connected to an outlet formed in a lower portion of the mixing chamber. A mixed fluid including the carrier gas and the liquid source material is discharged through the discharge path.

Vaporizer and thin film deposition apparatus including the same

A remote plasma generator includes a body, a driver, and a protection tube. The body includes a gas injection port, a plasma exhaust port, and a plasma generation pipe through which discharge gas or plasma flow. The driver is coupled to the body and generates a magnetic field and plasma in the body. The protection tube is at an inner side of the plasma generation pipe to protect the plasma generation pipe from plasma.

Remote plasma generator using ceramic

A wafer aligning apparatus includes a laser sensor that generates a trigger signal, a CCD camera imaging a wafer in response to the trigger signal, a signal processing unit that calculates a center alignment correction value for the wafer, and a robot controller that receives the center alignment correction value to control movement of a transfer robot. The laser sensor generates the trigger signal in accordance with a change in reflected light detected by the laser sensor, the change in the amount of reflected light being detected by the laser sensor when a boundary between a blade of the transfer robot and a coupler of the transfer robot passes under the laser sensor.

Wafer aligning apparatus and related method

Embodiments of the invention provide a wafer aligning apparatus and a wafer aligning method. In one embodiment, the wafer aligning apparatus comprises an imaging unit adapted to take an image of a wafer being transferred from a load lock chamber to a transfer chamber and adapted to convert the image into digital signals, and a signal processing unit adapted to calculate a center alignment correction value for the wafer by comparing the digital signals to a master image stored in the signal processing unit. The wafer aligning apparatus further comprises a robot controller adapted to receive the center alignment correction value from the signal processing unit and adapted to control a transfer robot in accordance with the center alignment correction value to provide the wafer to a process chamber such that the center of the wafer is substantially aligned.

Growing community of inventors

Suwon-si, South Korea

Heok-Jae Lee