Motorola Corporation

Fender Musical Instruments Corporation

Emerson Network Power - Embedded Computing, Inc.

Henry Wong

John E Gatti

Charles Christopher Hill

John H Kelly

Suzanne Marye Wong

Naufel Chafic Naufel

Kenneth W Porter

Thomas J Bertram

Kevin Bradley Reddy

Dale C Blankenship

Max Michael Gutnik

Dennis E Liles

James Matisán Gifford

Multi-effects processor

A rear transition module () includes a connector () in an RP0 mechanical envelope (), and an RTM alignment and keying mechanism () in the RP0 mechanical envelope of the rear transition module that uniquely corresponds to a first signal path configuration () in a corresponding connector () on a backplane () of a VXS multi-service platform system chassis (), where the rear transition module is coupled to operate within the VXS multi-service platform system chassis having a VMEbus network () and a switched fabric () coincident on the backplane.

RTM alignment and keying mechanism

An integrated power supply air inlet unit () coupled to slidably insert into a first interspace region () of an embedded computer chassis (), where the first interspace region is defined by a module portion (), a rear surface () and a first side surface (), includes a power supply () coupled to supply power to the embedded computer chassis, and a front surface () that is substantially perpendicular to the first side surface. A cooling air mass () is drawn into the embedded computer chassis through the front surface in a direction substantially perpendicular () to the front surface, where upon entering the integrated power supply air inlet unit the cooling air mass is turned substantially ninety degrees to flow over the module portion in a direction substantially parallel the front surface, and where the integrated power supply air inlet unit is hot-swappable in the embedded computer chassis.

Integrated power supply and air inlet unit

A method of directly transferring data across a CompactPCI&#x2122; backplane () via a fully meshed orthogonal network (). The CompactPCI backplane () incorporates a different type connector at its Plocation, in conjunction with a standard family of IEC 61074 connectors at its PPPand Plocations, to provide high speed data transfer with additional shielding and noise control.

Compact PCI backplane and method of data transfer across the compact PCI backplane

A method of cooling a module portion () of an embedded computer chassis (), where the module portion comprises a front module () coupled to a front portion of a backplane (), and a rear module () coupled to a rear portion of the backplane, where the front module and the rear module are horizontally disposed, the method includes drawing a cooling air mass () into the embedded computer chassis through a front surface () of a first interspace region () and an upper front surface () of a second interspace region () in a direction substantially perpendicular () to the front surface and the upper front surface. A third interspace region () receives a first portion of the cooling air mass (), the cooling air mass exhausting from the embedded computer chassis through a rear surface () in a direction substantially perpendicular () to the rear surface.

Method and apparatus for cooling a module portion

A latching apparatus () for mounting a computer module () in a holding fixture () is disclosed, where the computer module comprises a baseboard () and a faceplate (). The latching apparatus includes a handle () rotatably coupled to the baseboard, where the handle has an outer portion () and an inner portion (), where the outer portion includes a locking pin () substantially parallel to the faceplate, and where the handle is movable between a latched position () and an unlatched position (). A retention spring mechanism () having a latching portion () and a positional portion (), where the latching portion springably retains the handle in the latched position by engaging the locking pin, and where the positional portion frictionally interfaces with the inner portion of the handle to engage the handle in any of a plurality of positions. Latching apparatus can also include a handle stop () coupled to prevent the handle from opening past the unlatched position.

Latching apparatus for mounting a computer module

A cabinet ( ) for cooling electronic modules includes a first side surface ( ), a second side surface ( ), a front surface ( ) and a rear surface ( ). A plurality of chassis ( ) is encompassed by the plurality of outer surfaces, wherein the plurality of chassis ( ) and the first side surface ( ) define a first interspace region ( ), and wherein the plurality of chassis ( ) and the second side surface ( ) define a second interspace region ( ). A plurality of electronic modules ( ) is coupled to each of the plurality of chassis ( ), where the plurality of electronic modules ( ) are substantially horizontally disposed within each of the plurality of chassis ( ), and wherein at least a portion of the plurality of electronic modules produce more than 150 Watts of thermal energy each. An air moving apparatus ( ) draws cooling air ( ) external to the cabinet ( ) into the first interspace region ( ), wherein the cooling air ( ) passes over the plurality of electronic modules ( ) in a substantially horizontal manner and substantially parallel to the front surface ( ) and the rear surface ( ), wherein the cooling air ( ) subsequently enters the second interspace region ( ) and is thereafter exhausted from the cabinet ( ).

Cabinet for cooling electronic modules

A method of directly transferring data across a CompactPCI&trade; backplane ( ) via a fully meshed orthogonal network ( ). The CompactPCI backplane ( ) incorporates a different type connector at its P location, in conjunction with a standard family of IEC 61074 connectors at its P , P , P , and P locations, to provide high speed data transfer with additional shielding and noise control.

An apparatus for removing heat ( ) from a component ( ) located on a surface ( ) of an electronics module ( ). The apparatus includes a heat removal device ( ) mounted to electronics module ( ) a radial distance ( ) away from component ( ) and a heat conductor ( ) having a first portion ( ) coupled to component ( ) and a second portion ( ) coupled to heat removal device ( ). A method for removing heat ( ) from a component ( ) on a surface ( ) of an electronics module ( ) includes generating heat ( ), conveying the heat from the component ( ) by way of a heat conductor ( ) and depositing the heat ( ) to a heat removal device mounted to the electronics module ( )

Method and apparatus for removing heat from a component

A cooling fan (FIG.,) generates an air current, which includes a substantial swirl component, along a first direction (,). When the air current reaches the first plate (,), which is predominantly perpendicular to the direction of the airflow, a portion of the air current is routed toward a second direction (,) which is perpendicular to the first direction (,) thereby providing airflow to electronic equipment along the second direction (,). A second portion of the air current is routed towards a direction to the opposite of second direction (,) by way of a second plate (,) which lies along the second direction (,) and is tilted in an upward direction. Additionally, the second plate (,) includes narrow and wide end portions (,and,, respectively) which serves to direct a portion of the air current opposite that of the second direction (,).

Growing community of inventors

Tempe, AZ, United States of America

Henry Wong