Metrospec Technology, L.l.c.

Datacard Corporation

Minnesota Mining and Manufacturing Company

Ppt Vision, Inc.

Colorspan Corporation

Analog Technologies Corporation

Chassis Liner

Henry V Holec

Wm Todd Crandell

Brian J Hillstrom

Eric Henry Holec

Robert Anthony Laumeyer

John E Potts

Danny James Vatland

Owen L Nelson

Benjamin P Leonard

John H Bode

Mike V Atkinson

Greg Parkhurst

Gary Paul Mattila

Cory Dean Wooldridge

Jeffrey J Rust

William Francis Kraetz

Timothy M Gack

F Charles Baggeroer

Eric R Seckerson

Dirk R Helgemo

Embodiments herein relate to high output LED light sources with heat sinks. In an embodiment, a high-output LED light source is included having at least one LED; a circuit board, wherein the at least one LED is mounted on a first side of the circuit board; and a coil shaped heat sink, wherein the coil shaped heat sink is thermally bonded to a second side of the circuit board. In an embodiment, a high-output LED light source is included having at least one LED, a circuit board, wherein the at least one LED is mounted on a first side of the circuit board and a continuous flat wire heat sink. The continuous flat wire heat sink can be soldered to a second side of the circuit board and the continuous flat wire heat sink can be oriented perpendicular to the circuit board. Other embodiments are also included herein.

Compact high output LED light source with heat sink

Embodiments disclosed herein include to interconnectable circuit boards that can be constructed into three-dimensional shapes for use as lighting sources. An interconnectable circuit board array is included having a plurality of circuit board assemblies. The circuit board assemblies can include a first longitudinal edge, and a second longitudinal edge, and a plurality of bendable lateral board to board connectors. The plurality of bendable lateral board to board connectors are configured to provide electrical communication between a first circuit board from amongst the plurality of circuit board assemblies and a second circuit board from amongst the plurality of circuit board assemblies. Longitudinal edges of the first circuit board and of the second circuit board define a gap between the first circuit board and the second circuit board. The gap being bridged by at least one of the lateral board to board connectors. Other embodiments are also included herein.

Interconnectable circuit boards adapted for three-dimensional constructions as lighting sources

Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.

LED lighting systems and methods

Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.

Flexible circuit board interconnection and methods

LED lighting systems and method

In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.

Interconnectable circuit boards

In an embodiment, a solid-state lighting circuit is included herein having a first plurality of emitters configured to output light of a first color and a second plurality of emitters configured to output light of a second color. The circuit further includes a current limiting circuit and at least one biasing resistor operably connected to the first plurality of emitters and the current limiting circuit. Current is biased toward the first plurality of emitters until a preselected current limit is reached for the first plurality of emitters, such that the first plurality of emitters outputs the light of the first color. When current is provided by the constant current power supply that is at or above the preselected current limit, current passes through the second plurality of emitters such that the second plurality of emitters outputs the light of the second color. Other embodiments are also included herein.

Solid state lighting circuit with current bias and method of controlling thereof

Embodiments include an interconnectable circuit board array. The interconnectable circuit board array includes a plurality of interconnectable circuit boards coupled together with a plurality of board to board connectors. The board to board connectors include a first lateral side conductor and a second lateral side conductor to provide electrical communication between the connect circuit boards. The board to board connectors are configured such that when two adjacent circuit boards are bent in a lateral plane with respect to one another to form an angle, one of the lateral side conductors is contracted, one of the lateral side conductors is expanded, or one of the lateral side conductors is contracted and the other lateral side conductor is expanded. Other embodiments are also included herein.

Interconnectable circuit boards adapted for lateral in-plane bending

Circuit board having a plated through hole through a conductive pad

Circuit board having a plated through hole passing through conductive pads on top and bottom sides of the board and the board

Growing community of inventors

Mendota Heights, MN, United States of America

Henry V Holec