Atlantic Inertial Systems, Inc.

Henry Thomas

A sensor package includes a sensor, at least one external wall, and an interposer, arranged between the sensor and the at least one external wall. The sensor is wire bonded to the interposer and the interposer is wire bonded to the at least one external wall. Using an interposer, wire bonded to both the sensor and the at least one external wall, is an improved approach to electrically connecting a sensor and a sensor package. The interposer allows for short wire bonds from the sensor and the at least one external wall to the interposer, replacing the single, long wire bond from the sensor to the at least one external wall in the prior art. This provides improved resilience of the sensor package under high stress. Furthermore, it allows an existing sensor and package combination to be improved without needing to redesign either component.

Sensor packages

A mounting system for mounting an electronic component () in a housing () comprises a visco-elastic damping element () for damping the transmission of vibration from the housing () to the component () in use, and a support () for supporting the component () in the housing () independently of the damping element () whereby the weight of the component () is substantially or completely removed from the damping element (). The support () is configured to be selectively releasable from the component () such that the component () is then supported only by the damping element ().

Anti-vibration mounting system

An assembly () for attachment to a projectile comprises a first part () and a second part () mounted for rotation relative to the first part () about an axis (A). There is an axial gap (G) between the first and second parts (). At least one plastically deformable element () is arranged within the gap (G) between the first and second parts (), the plastically deformable element () being such as to deform due to the closing of the axial gap (G) between the first and second parts () during launch of the projectile.

Projectiles

An electronic device comprises a circuit substrate (), and a moulded interconnect device () incorporating integral legs () to mount the interconnect device upon the substrate, the legs spacing at least one of the legs carrying a conducting track () to provide an electrical interconnection between the interconnect device and the substrate. The substrate () may comprise another moulded interconnect device and may be mounted upon a processor () and may include an electromagnetic shield () on its lower surface.

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Plymouth, United Kingdom

Henry Thomas