Hughes Aircraft Company

Henry T Peterson

Alex M Leupp

Denis J McGreivy

Dennis H Hawkins

A method is described for attaching sapphire, quartz, Spinel, etc. die to gold pads in a ceramic package. Because sapphire is not directly bondable to or alloyable with gold, while silicon is, silicon is either evaporated or deposited onto the backside of a sapphire or silicon-on-sapphire wafer. After the wafer has been scribed into die, the die are attached to the gold pads in the ceramic package using a gold-silicon preform as an intermediate layer.

Eutectic die attachment method for integrated circuits

A liquid crystal display addressable by a backplate semiconductor MOSFET switching matrix is made light insensitive by ion implanting the backplate around the MOSFETs to prevent the formation of photon generated inversion layers and by extending the reflective back electrodes over the MOSFETs to prevent incident light from striking those areas of the backplate which are not protected by ion implantation.

Growing community of inventors

Irvine, CA, United States of America

Henry T Peterson