P.c.t. Systems, Inc.

Other

Henry R Miranda

Mark Dye

Sharyl L Maraviov

Ahmed Busnaina

Garry L Montierth

A cost effective and environmentally sound method for quickly removing liquid from surfaces of a substrate under manufacture without leaving behind substantial residue (e.g., silicon elements from the substrate, commonly known in the field as 'water marks'). The process includes first providing a substrate (e.g., a semiconductor wafer, glass flat panel, or disc media), which has undergone one or more liquid-based processes (e.g., cleaning, scrubbing, rinsing, etc.). An upper surface and a lower surface of the substrate are then subjected to vacuum suction, thereby removing liquid thereon. An apparatus for removing liquid from surfaces of a substrate is also provided. The apparatus includes a plurality of vacuum application members configured for applying vacuum suction to surfaces of a substrate, thereby removing liquid therefrom. The vacuum application member includes, for example, vacuum slots configured for disposition in proximity to the substrate surfaces and/or at least partially porous tubes configured for moving contact with the substrate surfaces. The apparatus can process one substrate at a time or remove liquid from multiple substrates simultaneously.

Method and apparatus for removing liquid from substrate surfaces using suction

A variety of techniques may be employed, alone or in combination, to enhance contact between a processed substrate and applied megasonic energy. In accordance with one embodiment of the new invention, the vibration plate is brought into intimate contact with one surface of the substrate, while cleaning or processing fluid contacts the other. In accordance with an alternative embodiment of the present invention, a reflecting surface may be provided to cause emanated energy to be reflected back into the near field and make it more uniform. In accordance with another alternative embodiment of the present invention, energy may be transferred across a substrate bounded on both sides by liquid with incidence of megasonic energy that is either normal to the substrate surface or within a critical range of incident angles. In yet another embodiment, generated dilatational waves may be converted to surface waves prior to contacting the substrate.

Method and apparatus to process substrates with megasonic energy

A bath system for processing semiconductor wafers with an efficient and uniform delivery of sonic energy to the semiconductor wafers. The bath system includes a container (e.g., a quartz container) configured for receiving at least one semiconductor wafer (e.g., a 300 mm diameter semiconductor wafer) and holding processing liquid. The container has two vertical sidewalls and two angled walls, with each of the two angled walls being disposed below one of the vertical sidewalls. The bath system also includes at least one sonic transducer attached to each of the two angled walls. These sonic transducers are arranged so that sonic energy emanating therefrom is directed across the at least one semiconductor wafer during processing. The system further includes at least one sonic transducer attached to each of the vertical sidewalls. The sonic transducers attached to each of the vertical sidewalls are also arranged so that sonic energy therefrom is directed across the at least one semiconductor wafer during processing.

Bath system with sonic transducers on vertical and angled walls

A bath system having a container with vertical upper sidewalls, a bottom and oblique walls. Each oblique wall joins the bottom to a sidewall, with ends joining the sidewalls, bottom and oblique walls to form an open enclosure for the container. An inlet is mounted to the bottom so that fresh processing liquid pass in a laminar flow over the surfaces of semiconductor wafers held in the container. High power sonic transducers are mounted to the oblique walls to deliver unimpeded sonic energy to the surfaces of the wafers. In operation, the sonic transducers on each oblique wall are multiplexed so that deleterious interference between the sonic waves from the two oblique walls is avoided.

Bath system for semiconductor wafers with obliquely mounted transducers

The present invention provides for a semiconductor bath system which has a tank, a housing which joins the tank, and a seal for the joint between the housing and the tank. A porous conduit is placed in close proximity with the seal. A pump drives washing fluid through the conduit and through the walls of the conduit so that the fluid irrigates the seal to preserve its integrity.

Washing unit for joint seal in a semiconductor bath system

The present invention provides for an easily replaceable dump valve assembly to drain a tank in a semiconductor bath system. The dump valve assembly has a drain at a bottom of the tank, a cap, a sealing plate and an actuator. The drain has an end with a flange around it. The cap has a base and side, with the side having an inward protrusion so that the cap can be fitted over the drain with the inward protrusion engaging the flange. The cap can be removed from the drain by simply disengaging the protrusion from the flange. The sealing plate has a surface to contact the end of the drain opening to seal the drain. To move the sealing plate, the actuator is connected to the cap and plate. The actuator drives the plate away from the cap base to place the plate surface against the drain end to close the dump valve assembly and drives the plate toward the cap to remove the plate surface from the drain opening to open the dump valve assembly.

Modular dump valve assembly in a semiconductor bath system

The present invention provides a method and apparatus for a removable weir overflow bath system with gutter which decreases manufacturing costs and increases user flexibility. Manufacturing costs are decreased by forming a weld with a low probability of breakage. Because breakage probability is low material costs and labor costs resulting from bath system manufacture is reduced. Furthermore, the present invention offers increased flexibility since the user need only replace the removable weir to change the scallop characteristics and obtain a new bath system. The preferred embodiment of the present invention includes a four-sided removable weir and a quartz container with gutter. The gutter region of the container is formed by welding a member of an L-shaped quartz structure to the top edge of an open top rectangular quartz container. A resilient material is placed on top of the gutter region along the corner formed by the gutter region and quartz container. The removable weir is placed on top of the resilient material. Pressure is applied to the top of the removable weir so that the resilient material conforms to and forms a seal between the sides and bottom of the removable weir and the gutter region.

Method and apparatus for removable weir overflow bath system with gutter

A bath system for processing semiconductor wafers includes a container having walls with a sonic transducer mounted on the outside of one side wall which is oblique to the other side walls. The thickness of the one side wall permits sonic energy to pass therethrough to wafers held in a liquid bath. Liquid and gas are introduced into the housing from the bottom wall.

Multiprocessing sonic bath system for semiconductor wafers

A rectangular container having a divider at one end of the container. The divider separates the container into a large processing region and a second region from which the solvent fluid is drained from the container. The divider acts as a weir over which the solvent flows from the processing region into the second region. Contaminating particles which fall onto the surface of the solvent and are momentarily trapped by surface tension are quickly removed from the processing region by the overflow action into the second region.

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Fremont, CA, United States of America

Henry R Miranda