H.b. Fuller Company

Henry P Meyer

Anthony J Ostlund

Sudipto Das

Disclosed is an article that includes a first substrate, a second substrate, and a re-workable adhesive composition, the first substrate being bonded to the second substrate through the adhesive composition. The adhesive composition is derived from a moisture curable polyurethane hot melt adhesive composition that includes a polyurethane prepolymer that includes the reaction product of a first crystalline polyester polyol having a number average molecular weight of from at least 5500 grams per mole (g/mol) to about 20,000 g/mol and a melting point of at least 40&#xb0; C., and a polyisocyanate. The re-workable adhesive composition is cleanly removable from at least one of the first substrate and the second substrate after conditioning the article at a temperature of from at least 60&#xb0; C. to no greater than 100&#xb0; C. for a period of about 30 minutes.

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Stillwater, MN, United States of America

Henry P Meyer