Motorola Corporation

Henry L Pfizenmayer

Frederick C Wernett

Scott L Craft

A semiconductor device (10) is formed to have multiple external connection pads (17, 18) for an active element (12). The multiple external connection pads (17, 18) are electrically connected together with a electrical link (19). After testing, the electrical link (19) is removed to disconnect the multiple external connection pads (17, 18) from each other.

Semiconductor device

Semiconductor device and method therefor

An electronic component with reduced capacitance includes a substrate (12) with an interconnect line (14), an additional substrate (11) with an interconnect line (13) wherein the substrate (12) overlies the additional substrate (11), an electronic device (15) overlying the substrate (12) and electrically coupled to the interconnect line (14) of the substrate (12), and an additional electronic device (17) having a lead (23) and an additional lead (26) wherein the lead (23) overlies the substrate (12) and is electrically coupled to the interconnect line (14) of the substrate (12) and wherein the additional lead (26) overlies the additional substrate (11) and is electrically coupled to the interconnect line (13) of the additional substrate (11).

Electronic component having reduced capacitance

A transformer mount (11) supports a transformer (12) over a component (22) on a substrate (23) of a hybrid module (10). The transformer mount (11) conserves space in the hybrid module (10), improves high frequency performance by minimizing parasitic capacitances and inductances of the transformer mount (11), is compatible with subsequent high temperature and batch processing for faster assembly, permits the flow of defluxing materials beneath the transformer mount (11), is inexpensive, and provides appropriate access to fine tune the transformer (12) during assembly.

Mount for supporting a high frequency transformer in a hybrid module

An amplitude modulated optical signaling system having improved linearity and reduced distortion is provided by detecting a portion of the optical output from the light emitter to obtain an electrical feedback signal and phase reversing a first portion of the feedback signal and degeneratively combining it with the electrical input signal of the system to obtain a combined signal for ac modulating the light emitter. A second portion of the feedback signal is desirably time averaged and used to control the dc drive to the light emitter so that the average light output is substantially constant. The distortion otherwise introduced into the optical signaling system by the non-linearity associated with optical emitters driven at high power levels is reduced.

Optical communication system with reduced distortion

Hybrid RF amplifiers of improved performance are obtained by arranging film resistors, metallization and other components on a circuit board so that symmetrical parts of the electrical circuit are arranged in a mirror symmetrical fashion about a line extending along the circuit board and by aligning symmetrical resistors either parallel or orthogonal to this line and by utilizing common ground metal regions to terminate resistors that are aligned and orthogonal to the mirror line and spaced apart but joined to a common ground at a single location.

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Phoenix, AZ, United States of America

Henry L Pfizenmayer