Apple Inc.

Henry H Lam

Derek William Wright

Ihtesham H Chowdhury

Amaury J Heresztyn

An electronic device can include a heat transfer structure that is positioned between a first component that generates heat and a second component that dissipates heat. The heat transfer structure transfers heat from the first component to the second component. The heat transfer structure can include a heat transfer member including a thermal conductive layer attached to at least one flexible layer and at least one deformable region created by a shape of the heat transfer member.

Growing community of inventors

San Jose, CA, United States of America

Henry H Lam