Intel Corporation

International Business Machines Corporation

Henry C Bosak

Harvey R Kofstad

Jeffory L Smalley

Thomas A Boyd

Tao Liu

Mani Prakash

Susan F Smith

Geoffrey Brian Ford

Anthony K Wong

Almanzo T Ortiz

Embodiments of the present disclosure describe servers having thermal management features and thermal management systems for servers. These embodiments include heat sinks to be thermally coupled by one or more heat pipes to transfer heat from hotter downstream heat sinks to cooler upstream heat sinks in order to distribute thermal loading across multiple devices. In one embodiment a single heat pipe may be used to thermally couple two heat sinks, whereas in other embodiments a modular heat pipe arrangement may be used. Techniques for thermally coupling modular heat pipes to one another such that vapor sections of adjacent heat pipes overlap are also disclosed. Other embodiments may be described and/or claimed.

Server thermal management with heat pipes

An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.

Multi-chip self adjusting cooling solution

Embodiments of the present disclosure may include a heat removal assembly that is to thermally couple with two or more dice of an electronic device. The heat removal assembly may include a bellows to automatically adjust a position of at least one surface of the heat removal assembly relative to another surface of the heat removal assembly. Other embodiments may be described and/or claimed.

Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages

A flexible/foldable fastener carrier, comprising one or more captive fasteners inserted at predetermined positions on the carrier. The positions correspond to fastening points on a separate article being secured by the fastener, permitting the each fastener to align with the fastening point on the article when the carrier is placed on or around the article. Because the fasteners remain captive in the fastener carrier, they cannot be lost or inadvertently dropped into the device to which the article is being secured. After the article has been secured, the fastener carrier is retained in place for use if the article is removed or replaced, or the carrier is removed from the article without disturbing either the secure article or the fasteners.

Fastener carrier

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Hillsboro, OR, United States of America

Henry C Bosak