Microcoating Technologies, Inc.

Morton International, Inc.

Henry A Luten, Iii

Andrew Tye Hunt

Tzyy Jiuan Hwang

Wen-Yi Lin

Shara S Shoup

Helmut G Hornis

Girish N Deshpande

Hong Shao

Subramaniam Shanmugham

William D Danielson, Jr

Joe Thomas

John Eric McEntyre

A thin film product having a nanostructured surface, a laminate product including the thin film and a temporary substrate opposite the nanostructured surface, a laminate product including the thin film and a final substrate attached to the nanostructured surface and a method of producing the thin film products. The thin film is particularly useful in the electronics industry for the production of integrated circuits, printed circuit boards and EMF shielding. The nanostructured surface includes surface features that are mostly smaller than one micron, while the dense portion of the thin film is between 10-1000 nm. The thin film is produced by coating a temporary substrate (such as aluminum foil) with a coating material (such as copper) using any process. One such method is concentrated heat deposition or a combustion, chemical vapor deposition process. The resulting thin film provides a high level of adhesion to a final substrate, by embedding the nanostructures with the material of the final substrate (such as an epoxy resin). The surface of the thin film adjacent the temporary substrate substantially conforms to the substrate surface and has a relatively low peel strength. In this manner, the temporary substrate is easily removed from the thin film after attaching the opposite nanostructured side of the thin film to the final substrate with a resulting, higher peel strength.

Nanostructure coatings

An improved chemical vapor deposition apparatus and procedure is disclosed. The technique provides improved shielding of the reaction and deposition zones involved in providing CVD coatings, whereby coatings can be produced, at atmospheric pressure, of materials which are sensitive to components in the atmosphere on substrates which are sensitive to high temperatures and which are too large, or inconvenient, to process in vacuum or similar chambers. The improved technique can be used with various energy sources and is particularly compatible with Combustion Chemical Vapor Deposition (CCVD) techniques.

Apparatus and process for controlled atmosphere chemical vapor deposition

Precursor solutions are provided to produce thin film resistive materials by combustion chemical vapor deposition (CCVD) or controlled atmosphere combustion chemical vapor deposition (CACCVD). The resistive material may be a mixture of a zero valence metal and a dielectric material, or the resistive materials may be a conductive oxide.

Precursor solution compositions for electronic devices using CCVD

Growing community of inventors

Doraville, GA, United States of America

Henry A Luten, Iii