Infineon Technologies Ag

Infineon Technologies Austria Ag

Henrik Hassander

Giuseppe Bernacchia

Jens A Ejury

Christian Lindholm

In accordance with an embodiment, switch driver includes a first switch driver configured to be coupled to a control node of a first switch, a second driver configured to be coupled to a control node of a second switch, and a first terminal and a second terminal configured to be couple to a boot capacitor. The first terminal is coupled between a boot input of the first switch driver and the second terminal is configured to be coupled to outputs of the first switch and the second switch. The switch driver further includes a voltage measurement circuit coupled to the first terminal and the second terminal, and a control circuit configured to activate the second switch driver when the voltage measurement circuit indicates that a voltage across boot capacitor is below a first threshold.

System and method for a switch driver

Some aspects of the present disclosure relate to an apparatus that includes an integrated chip having a bandgap reference circuit and one or more heating elements. The bandgap reference circuit is located within a subset of the integrated chip and outputs a reference voltage having a temperature dependence. The one or more of the heating elements vary the temperature of the subset of the integrated chip.

Growing community of inventors

Villach, Germany

Henrik Hassander