Asml Netherlands B.v.

Henricus Petrus Maria Pellemans

Arie Jeffrey Den Boef

Antoine Gaston Marie Kiers

Maurits Van Der Schaar

Arno Jan Bleeker

Mircea Dusa

Youri Johannes Laurentius Maria Van Dommelen

Paul Frank Luehrmann

Cedric Desire Grouwstra

Markus Gerardus Martinus Van Kraaij

Hugo Augustinus Joseph Cramer

Andre Bernardus Jeunink

Markus Gerardus Martinus Maria Van Kraaij

Gerbrand Van Der Zouw

Irwan Dani Setija

Sebastianus Adrianus Goorden

Armand Eugene Albert Koolen

Simon Reinald Huisman

Leon Martin Levasier

Willem Marie Julia Marcel Coene

Hoite Pieter Theodoor Tolsma

Cédric Désiré Grouwstra

Stefan Geerte Kruijswijk

Pavel Stanislavovich Antsiferov

Johannes Matheus Marie De Wit

Amandev Singh

Ingo Dirnstorfer

Marcus Adrianus Van De Kerkhof

Patricius Aloysius Jacobus Tinnemans

Simon Gijsbert Josephus Mathijssen

Patrick Warnaar

Hans Van Der Laan

Hendrik Jan Hidde Smilde

Michael Kubis

Martin Ebert

Vladimir Mihailovitch Krivtsun

Vladimir Mikhailovich Krivtsun

Alessandro Polo

Johannes Hubertus Antonius Van De Rijdt

Reinder Teun Plug

Stefan Carolus Jacobus Antonius Keij

Nitish Kumar

Henricus Martinus Johannes Van De Groes

Peter Clement Paul Vanoppen

Wilhelmus Maria Corbeij

Arjan Johannes Anton Beukman

Johan Maria Van Boxmeer

Chien-Hung Tseng

Filippo Alpeggiani

Ralph Jozef Johannes Gerardus Anna Maria Smeets

Robert Franken

Ralph Josef Johannes Gerardus Anna M Smeets

Cas Johannes Petrus Maria Van Nuenen

Marcel Pieter Jacobus Peeters

Wilhelmus Maria Corbeije

Maurits Van Der Sohaar

A scatterometer for measuring a property of a target on a substrate includes a radiation source, a detector, and a processor. The radiation source produces a radiated spot on the target. The scatterometer adjusts a position of the radiated spot along a first direction across the target and along a second direction that is at an angle with respect to the first direction. The detector receives radiation scattered by the target. The received radiation is associated with positions of the radiated spot on the target along at least the first direction. The detector generates measurement signals based on the positions of the radiated spot on the target. The processor outputs, based on the measurement signals, a single value that is representative of the property of the target. The processor also combines the measurement signals to output a combined signal and derives, based on the combined signal, the single value.

Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method

Disclosed is a method of metrology such as alignment metrology. The method comprises obtaining pupil plane measurement dataset at a pupil plane relating to scattered radiation resultant from a measurement of a structure. The method comprises determining a measurement value or correction therefor using the pupil plane measurement dataset and a sensor term relating to sensor optics used to perform said measurement.

Metrology method and lithographic apparatuses

An apparatus and method to determine a property of a substrate by measuring, in the pupil plane of a high numerical aperture lens, an angle-resolved spectrum as a result of radiation being reflected off the substrate. The property may be angle and wavelength dependent and may include the intensity of TM- and TE-polarized radiation and their relative phase difference.

Method and apparatus for angular-resolved spectroscopic lithography characterization

Disclosed is a metrology apparatus comprising an optical element configured to receive at or near a pupil plane of the metrology apparatus, at least first radiation comprising a first higher diffracted order and second radiation comprising a zeroth order resulting from illumination of a metrology target with radiation; and to direct said first radiation and second radiation together in a first direction. The metrology apparatus is further configured to form at least a first image of a first interference pattern, the first interference pattern resulting from interference of said first radiation and second radiation at an image plane.

Position metrology apparatus and associated optical elements

A method of aligning a substrate within an apparatus. The method includes determining a substrate grid based on measurements of a plurality of targets, each at different locations on a substrate. The determining includes repetitions of updating the substrate grid after each measurement of a target, and using the updated grid to align a measurement of a subsequent target.

Alignment method and associated metrology device

Disclosed is a metrology device () configured to produce measurement illumination comprising a plurality of illumination beams, each of said illumination beams being spatially incoherent or pseudo-spatially incoherent and comprising multiple pupil points in an illumination pupil of the metrology device. Each pupil point in each one of said plurality of illumination beams has a corresponding pupil point in at least one of the other illumination beams of said plurality of illumination beams thereby defining multiple sets of corresponding pupil points, and the pupil points of each set of corresponding pupil points are spatially coherent with respect to each other.

Metrology sensor for position metrology

A device manufacturing method is disclosed. A radiated spot is directed onto a target pattern formed on a substrate. The radiated spot is moved along the target pattern in a series of discrete steps, each discrete step corresponding to respective positions of the radiated spot on the target pattern. Measurement signals are generated that correspond to respective ones of the positions of the radiated spot on the target pattern. A single value is determined that is based on the measurement signals and that is representative of the property of the substrate.

A lithographic apparatus is disclosed. The lithographic apparatus includes a scatterometer configured to measure a property of the substrate. The scatterometer includes a radiation source configured to produce a radiated spot on a target on the substrate, where the radiated spot includes positions on the target. The scatterometer further includes a detector configured to generate measurement signals that correspond to respective ones of the positions of the radiated spot and a processor configured to output, based on the measurement signals, a single value that is representative of the property of the substrate.

An inspection apparatus () includes a focus monitoring arrangement ('). Focusing radiation () comprises radiation having a first wavelength and radiation having a second wavelength. Reference radiation and focusing radiation at each wavelength are provided with at least one relative frequency shift so that the interfering radiation detected in the detection system includes a time-varying component having a characteristic frequency. A focus detection system () comprises one or more lock-in detectors (). Operating the lock-in detectors with reference to both the first and second characteristic frequencies allows the arrangement to select which of the first and second focusing radiation is used to determine whether the optical system is in focus. Good quality signals can be obtained from targets of different structure.

Focus monitoring arrangement and inspection apparatus including such an arrangement

Inspection apparatus () is used for measuring parameters of targets on a substrate. Coherent radiation follows an illumination path (solid rays) for illuminating target (T). A collection path (dashed rays) collects diffracted radiation from the target and delivers it to a lock-in image detector (). A reference beam following a reference path (dotted rays). An acousto-optical modulator () shifts the optical frequency of the reference beam so that the intensity of radiation at the lock-in detector includes a time-varying component having a characteristic frequency corresponding to a difference between the frequencies of the diffracted radiation and the reference radiation. The lock-in image detector records two-dimensional image information representing both amplitude and phase of the time-varying component. A second reference beam with a different shift () follows a second reference path (dot-dash rays). Interference between the two reference beams can be used for intensity normalization.

Inspection apparatus and methods, methods of manufacturing devices

Growing community of inventors

Veldhoven, Netherlands

Henricus Petrus Maria Pellemans