Epcos Pte Ltd

Henrick Laurids Hvims

Pirmin Rombach

Matthias Müllenborn

Siebe Bouwstra

Ole Hansen

Matthias Heschel

Maja Amskov Gravad

Jørgen B Elmer, Legal Representative

A solid state silicon-based condenser microphone comprising a silicon transducer chip (). The transducer chip includes a backplate () and a diaphragm () arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm () is movable relative to the backplate () in response to incident sound. An integrated electronic circuit chip () or ASIC is electrically coupled to the transducer chip (). An intermediate layer () fixes the transducer chip () to the integrated electronic circuit chip () with the transducer chip () on a first side of the intermediate layer () and the integrated electronic circuit chip () on a second side of the intermediate layer () opposite the first side. The intermediate layer () has a sound inlet () on the same side as the ASIC giving access of sound to the diaphragm.

Solid state silicon-based condenser microphone

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Holte, Denmark

Henrick Laurids Hvims