Commissariat a L'energie Atomique

Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Stmicroelectronics (crolles 2) Sas

Compagnie Europeenne De Composants Electroniques

Stmicroelectronics (rousset) Sas

Henri Sibuet

Pierre Gaud

Jean-Baptiste Albertini

Christel Dieppedale

Christine Louis

Yannick Vuillermet

Michel Di Gioia

Nathalie Vallet

Jean-Marc Fedeli

Xavier Baillin

Bernard Diem

Bruno Reig

Stephan Borel

Laurent Dussopt

Jean-François Carpentier

Gwenael Le Rhun

Nicolas Sillon

Gerard Barrois

Patrice Deroux-Dauphin

G&eacute;rard Barrois

Brigitte Desloges

Alain Persico

Line R Vieux

Thierry Dupeux

Mickaël Fievre

Sylvain Pelloquin

A method and an electrical device with superimposed layers in an alternation of conductive layers and insulating layers. A mesa-type structure is formed, leaving for at least one conductive layer, an uncovered peripheral portion accessible for connection. In this portion, an electrically insulating pattern is configured in order to mark out an electrically insulated area located in the peripheral portion of said at least one of the electrically conductive layers. Application to electrical capacitances and redistribution layers for microelectronic devices.

Multilayer electrical device

A method for producing a microelectronic device including a substrate and a stack having at least one electrically conductive layer and at least one dielectric layer. The method includes formation, from one face of the substrate, of at least one pattern that is in depression with respect to a plane of the face of the substrate, the wall of the pattern having a bottom part and a flank part, the flank part being situated between the bottom part and the face of the substrate, the flank part having at least one inclined wall as far as the face of the substrate. With formation of the stack, the layers of the stack helping at least partially fill in the pattern. The stack is thinned of the stack at least as far as the plane of the face of the substrate so as to completely expose the edge of said at least one electrically conductive layer flush in one plane, and at least one electrical connection member is formed on the substrate in contact with the edge of the at least one electrically conductive layer.

Method for producing a microelectronic device

An assembly of two objects integral with each other through at least one linking element provided between both objects, said linking element including at least a first material portion comprising intermetallic compounds of a phase formed with a first brazing metal and a second metal the melting point of which is higher than that of the first brazing metal, said linking element further including at least a second material portion composed of at least a third metal, said second material portion contacting both objects.

Objects assembly through a sealing bead including intermetallic compounds

The invention concerns a method for the fabrication, on a plane substrate, of a microswitch actuatable by a magnetic field, comprising: a) the etching, in the upper face of the plane substrate, of cavities forming a hollow model of two strips, these cavities having vertical flanks extending perpendicularly to the plane of the substrate to form vertical faces of the strips, b) the filling of the cavities by a magnetic material to form the strips, then c) the etching in the substrate, by a method of isotropic etching, of a well that extends between the vertical faces of the strips and beneath and around one distal end of at least one of the strips to open out an air gap between these strips and make this distal end capable of being shifted between a closed position and an open position.

Method for fabricating a microswitch actuatable by a magnetic field

A millimeter wave transceiver including a plate forming an interposer having its upper surface supporting an interconnection network and having its lower surface intended to be assembled on an electronic device; at least one integrated circuit chip assembled on the upper surface of the interposer; at least one antenna including at least one track formed on the upper surface of the interposer; and at least one block attached under the plate and including in front of each antenna a cavity having a metalized bottom, the distance between each antenna and the bottom being on the order of one quarter of the wavelength, taking into account the dielectric constants of the interposed materials.

Integrated millimeter wave transceiver

The fabrication of a semiconductor fixed structure defining a volume, for example of a MEMS micro electro-mechanical system includes, determining thicknesses beforehand depending on the functional distances associated with elements. At least one element is formed on a substrate by thermal oxidation of the substrate so as to form an oxide layer followed by selective etching of the oxide layer so as to define the volume in an etched portion by baring the underlying substrate so as to define the element in an unetched portion, and later oxidation of the substrate so as to form an oxide layer, in order to obtain the elements at the functional distances.

Method for fabricating a fixed structure defining a volume receiving a movable element in particular of a MEMS

A magnetically actuatable contactor has first and second magnetic material strips extending longitudinally. Each has a pad with a contact face parallel to the longitudinal direction. The pads face each other when an intersection of the one contact face and a projection in a transversal direction of the other contact face forms an overlap zone having a surface area. A pad is capable of being transversally shifted in response to a magnetic field between closed and opened positions. In closed position and open positions, the faces and respectively in contact and separated. At least one strip forms pairs of facing pads disposed consecutively along the longitudinal direction. A bridge links two consecutive pads. A cross-section of the bridge is reduced relative to a cross-section of the pads and a surface area of a smallest cross-section of the bridge.

Contactor and switch

A micromachined electromechanical (MEMS) actuator including, for example, an electrostatically actuated electrical switch, is provided, including a first set of conducting plates forming part of the movable element of the switch, interdigitated with a set of conducting plates forming part of the substrate. The plates are, in principle, vertical relative to the surface of the substrate; they are in partial heightwise overlap and a control voltage applied between the two sets of plates exerts a vertical force acting so as to move the movable element closer to the substrate. The conducting plates of the movable element are connected to one another by conducting end crosspieces connecting the ends of these plates so as to surround, laterally, the stationary conducting plates. The distance separating one stationary plate end from the mobile crosspiece is the same at both ends so that the forces exerted in the elongation direction of the plates cancel out. This distance is preferably the same for all the plates.

Electromechanical actuator with interdigitated electrodes

An integrated magnetic head including a thin layer structure. The thin layer structure contains, in the edge of the structure constituting the reading and/or writing face of the magnetic head, two pole pieces separated by a gap and aligned longitudinally. The pole pieces are contained in the transverse direction with respect to the structure between parallel planes of the thin layer structure. The magnetic head bas two layers of wear-resistant material which frame the thin layer structure to reinforce the wear resistance of the reading and/or writing face.

Integrated magnetic head comprising a thin layer structure

A process for collectively making integrated magnetic heads with a bearing surface obtained by photolithography. According to the process, on a wafer is deposited a plurality of heads, a mask defining the profile of the bearing surfaces and the wafer is collectively engraved in the vicinity of the pole pieces of the heads. Such a process may find particular application to the making of magnetic heads.

Method for collective production of magnetic heads with rounded bearing surface

Magnetic head for use in magnetic recording and including an integrated coil having at least one winding around a non-embedded part of the magnetic circuit. The winding includes a lower sheet of conductors placed in a chamber etched in the substrate and which is integrated into this substrate. The magnetic head is manufactured in a process including forming on a solid substrate a magnetic circuit with a first and second polar part having embedded portions positioned side by side and separated by a nonmagnetic air gap. The magnetic circuit includes at least one non-embedded bridging part no portion of which is embedded in the substrate. A conductor coil is formed around the non-embedded part of the circuit by making a lower sheet of conductors passing underneath the non-embedded bridging part and by embedding the lower sheet in at least one chamber made in the substrate, and by making an upper sheet of conductors astride the non-embedded bridging part of the magnetic circuit.

Vertical magnetic head having a magnetic circuit with a non-embedded part and having an integrated coil surrounding the non-embedded part

Process for producing an assembly having several magnetic heads and multiple head assembly obtained by this process

A process for producing a vertical magnetic head for reading information from a magnetic media. The head includes a substrate on which is mounted an amagnetic spacer extending perpendicular to the face of the substrate. A first magnetic material is deposited in vapor phase thin film formed on either side of the spacer. A second magnetic material is deposited on the first by electrolytic growth.

Process for producing a vertical magnetic head

Vertical magnetic head having a magnetic circuit with a non-embedded

A vertically arranged magnetic head for reading information from magnetic media. The head includes a substrate on which is mounted an amagnetic spacer extending perpendicular to the face of the substrate. Two magnetic materials are deposited on the sides of the spacer, the first being deposited by a vapor phase and the second being deposited on the first by electrolytic growth.

Growing community of inventors

La Buisse, France

Henri Sibuet