Intel Corporation

Tahoe Research, Ltd.

Henning Braunisch

Johanna M Swan

Aleksandar Aleksov

Adel A Elsherbini

Georgios C Dogiamis

Shawna M Liff

Telesphor Kamgaing

Feras Eid

Daoqiang Lu

Sujit Sharan

Kemal Aygun

Krishna Bharath

Brandon M Rawlings

Neelam Prabhu Gaunkar

Gilroy J Vandentop

Diego Correas-Serrano

Chia-Pin Chiu

Stefanie M Lotz

Hinmeng Au

Veronica Aleman Strong

Richard J Dischler

Yidnekachew S Mekonnen

Zhiguo Qian

Mathew J Manusharow

Anna M George, Legal Representative

Javier Soto

Patrick R Morrow

Paul B Fischer

Kimin Jun

Zhichao Zhang

Peter Chang

Javier Soto Gonzalez

Thomas L Sounart

Hyung-Jin Lee

Brennen Karl Mueller

Sasha N Oster

Kristof Darmawikarta

William J Lambert

Beomseok Choi

Ajay Jain

Mauro J Kobrinsky

Sanka Ganesan

Stefano Pellerano

Bruce A Block

Fay Hua

Kenneth Edward Salsman

Andrew James Brown

Cynthia S Bell

Steven N Towle

Prithwish Chatterjee

Javier A Falcon

Raj Nair

Edris M Mohammed

Stephen Morein

Eric C Palmer

Chandrashekhar Ramaswamy

Don W Nelson

Gilbert W Dewey

Ian A Young

Kevin O'Brien

Kaan Oguz

Ravindranath Vithal Mahajan

Chuan Hu

Kaladhar Radhakrishnan

Peter L D Chang

Hengju Cheng

Thomas Dory

Rajashree Raji Baskaran

Yikang Deng

Shan X Wang

Rajendran Nair

Andrew Paul Collins

Jianyong Xie

Jeff C Morriss

Mark B Trobough

Andrew Alduino

Kevin P O'brien

Chintan S Thakkar

Cho-Ying Lu

I-Cheng Tung

Anna M George

Arnab Sarkar

Ajay Balankutty

John Tang

Timothy A Gosselin

Ahmed Abou-Alfotouh

Bram Leader

Prasanna Raghavan

Arghya Sain

Ankur Mohan Crawford

Said Rami

Prashant D Parmar

Thomas W Brown

Cooper S Levy

John S Cuendet

Gloria Alejandra Camacho Bragado

Victor J Prokoff

Nathan Fritz

Victor Prokoflev

Nathaniel Arbizu

Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

Components for millimeter-wave communication

Low leakage thin film capacitors for decoupling, power delivery, integrated circuits, related systems, and methods of fabrication are disclosed. Such thin film capacitors include a titanium dioxide dielectric and one or more noble metal oxide electrodes. Such thin film capacitors are suitable for high voltage applications and provide low current density leakage.

Low leakage thin film capacitors using titanium oxide dielectric with conducting noble metal oxide electrodes

In one embodiment, an apparatus includes a first die with voltage regulator circuitry and a second die with logic circuitry. The apparatus further includes an inductor, a capacitor, and a conformal power delivery structure on the top side of the apparatus, where the voltage regulator circuitry is connected to the logic circuitry through the inductor, the capacitor, and the conformal power delivery structure. The conformal power delivery structure includes a first electrically conductive layer defining one or more recesses, a second electrically conductive layer at least partially within the recesses of the first electrically conductive layer and having a lower surface that generally conforms with the upper surface of the first electrically conductive layer, and a dielectric material between the surfaces of the first electrically conductive layer and the second electrically conductive layer that conform with one another.

Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures

An integrated circuit package may be formed including at least one die side integrated circuit device having an active surface electrically attached to an electronic interposer, wherein the at least one die side integrated circuit device is at least partially encased in a mold material layer and wherein a back surface of the at least one die side integrated circuit device is in substantially the same plane as an outer surface of the mold material layer. At least one stacked integrated circuit device may be electrically attached to the back surface of the at least one die side integrated circuit through an interconnection structure formed between the at least one die side integrated circuit device and the at least one stacked integrated circuit device.

High-density interconnects for integrated circuit packages

An embedded silicon bridge system including tall interconnect via pillars is part of a system in package device. The tall via pillars may span a Z-height distance to a subsequent bond pad from a bond pad that is part of an organic substrate that houses the embedded silicon bridge.

Scalable embedded silicon bridge via pillars in lithographically defined vias, and methods of making same

Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include: a first die having a first surface and an opposing second surface, first conductive contacts at the first surface of the first die, and second conductive contacts at the second surface of the first die; and a second die having a first surface and an opposing second surface, and first conductive contacts at the first surface of the second die; wherein the second conductive contacts of the first die are coupled to the first conductive contacts of the second die by interconnects, the second surface of the first die is between the first surface of the first die and the first surface of the second die, and a footprint of the first die is smaller than and contained within a footprint of the second die.

Microelectronic assemblies

An integrated circuit (IC) die package substrate comprises a first trace upon, or embedded within, a dielectric material. The first trace comprises a first metal and a first via coupled to the first trace. The first via comprises the first metal and a second trace upon, or embedded within, the dielectric material. A second via is coupled to the second trace, and at least one of the second trace or the second via comprises a second metal with a different microstructure or composition than the first metal.

High-throughput additively manufactured power delivery vias and traces

Embodiments may relate an electronic device that includes a first server blade and a second server blade coupled with a chassis. The first and second server blades may include respective microelectronic packages. The electronic device may further include a waveguide coupled to the first and second server blades such that their respective microelectronic packages are communicatively coupled by the waveguide. Other embodiments may be described or claimed.

Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device

Millimeter-wave dielectric waveguide bundle including first and second adjacent dielectric waveguides having different core and/or cladding materials

Millimeter-wave dielectric waveguide including an opening of varying cross-section enclosed within a first material and the first material surrounded by a second material

A multi-chip package includes a substrate () having a first side (), an opposing second side (), and a third side () that extends from the first side to the second side, a first die () attached to the first side of the substrate and a second die () attached to the first side of the substrate, and a bridge () adjacent to the third side of the substrate and attached to the first die and to the second die. No portion of the substrate is underneath the bridge. The bridge creates a connection between the first die and the second die. Alternatively, the bridge may be disposed in a cavity () in the substrate or between the substrate and a die layer (). The bridge may constitute an active die and may be attached to the substrate using wirebonds ().

Multi-chip package and method of providing die-to-die interconnects in same

Microelectronic support for millimeter-wave communication including a transmission line trace and via pad spaced apart from a respective anti-trace and anti-pad

Embodiments may relate to a baseband module with communication pathways for a first data signal and a second data signal. The baseband module may also include a finite impulse response (FIR) filter in a communication path between the first signal input and the second signal output. Other embodiments may be described or claimed.

Dispersive waveguide crosstalk mitigation

An integrated circuit assembly may be fabricated having an electronic substrate, an integrated circuit device having a first surface, an opposing second surface, at least one side extending between the first surface and the second surface, and at least one through-substrate via extending into the integrated circuit device from the second surface, wherein the first surface of the integrated circuit device is electrically attached to the electronic substrate; and at least one power delivery route electrically attached to the second surface of the integrated circuit device and to the electronic substrate, wherein the at least one power delivery route is conformal to the side of the integrated circuit device and the first surface of the electronic substrate.

Power delivery structures

Growing community of inventors

Phoenix, AZ, United States of America

Henning Braunisch