Sae Magnetics (h.k.) Limited

Heng Wang

Masahiro Onishi

The invention relates to an optical module manufacturing method for bonding a can portion having an optical semiconductor element and a barrel portion of the optical module together, comprising the steps of: a bonding step for bonding a joint surface of the can portion and a joint surface of the barrel portion by thermoset adhesive, so as to form an interior room defined by the bonded can portion and barrel portion (S); a receiving step for receiving the bonded can portion and the barrel portion into a hermetical container (S); a curing step for heating interior of the hermetical container so as to solidify the thermoset adhesive dispensed on the joint surfaces (S); a cooling step for reducing a temperature inside the hermetical container after the thermoset adhesive is cured (S); and a step of taking the can portion and the barrel portion out from the hermetical container. The resin on the joint portion of the can portion and the barrel portion can be cured at a high temperature under condition that the can portion and the barrel portion are sealed together.

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Hong Kong, China

Heng Wang