Teradyne, Inc.

Dis Tech America, LLC

Heng-Kit Too

Brian Brecht

Richard Pye

Kenneth L Degan

Alfred M Zakarian

Max Zhang

Shih-Fan Chen

Julie Robison

Xue-Bin Tan

Roger A Plante

Rocky Tao

William Patti

Iris Weng

Mark Garcia

Hale Deng

An example system for maintaining the shape of a circuit board includes metal balls that are configured not to collapse in whole or part in response to a force below a predefined force and a temperature below a predefined temperature. The metal balls are configured to support a substrate and are part of electrical connections between the substrate and a circuit board. The system includes a fixture configured to apply force to the substrate while the substrate is subjected to the temperature. The fixture is configured to distribute the force across a surface of the substrate that is not in contact with the metal balls such that the force applied by the fixture and the support of the substrate by the metal balls maintains a shape of the substrate at the temperature.

Maintaining the shape of a circuit board

An example apparatus includes a first printed circuit board (PCB) having a power layer, a ground layer, and a slot. The slot includes a first power electrical contact that is electrically connected to the power layer and a first ground electrical contact that is connected to the ground layer. The slot extends orthogonally or obliquely through multiple layers of the first PCB. A second PCB includes a second power electrical contact, a second ground electrical contact, and capacitors electrically connected between the second power electrical contact and the second ground electrical contact. The second PCB is configured for insertion into the slot to form an electrical connection between the first power electrical contact and the second power electrical contact and between the first ground electrical contact and the second ground electrical contact.

Connecting circuit boards

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Oak Park, CA, United States of America

Heng-Kit Too