Infineon Technologies Ag

Heng Chen Tang

Subaramaniym Senivasan

Victor Dela Cruz Del Rosario

Ryan Tordillo Comadre

Bernie Tabanao Rosales

A semiconductor package includes a lead frame that includes a die pad and a plurality of leads, a semiconductor die mounted on a die attach surface of the die pad, an encapsulant body of electrically insulating material that covers semiconductor die and portions of the lead frame, and a fastener receptacle that includes a blind hole in the encapsulant body or the die pad, wherein a rear surface of the die pad is exposed from a first main face of the encapsulant body.

Growing community of inventors

Muar, Malaysia

Heng Chen Tang