Imec

Interuniversitair Microelektronica Centrum (imec)

Panasonic Corporation

King Abdulaziz City for Science and Technology

Katholieke Universiteit Leuven

Interuniversitair Micorelektronica Centrum (imec, Vzw)

Hendrikus Tilmans

Walter De Raedt

Xavier Rottenberg

Henri Jansen

Eric Beyne

Yasuyuki Naito

Veronique Rochus

Ilja Ocket

Philippe Helin

Phillip Ekkels

Mahmoud A Farghaly

A two-axes MEMS magnetometer includes, in one plane, a freestanding rectangular frame having inner walls and four torsion springs, wherein opposing inner walls of the frame are contacted by one end of only two torsion springs, each torsion spring being anchored by its other end, towards the center of the frame, to a substrate. In operation, the magnetometer measures the magnetic field in two orthogonal sensing modes using differential capacitance measurements.

Two axes MEMS resonant magnetometer

In a MEMS elementwhere a MEMS structureis hermetically sealed in a cavityby a substrateand laminated structure, interface sealing layersandare provided between two layers that constitute the laminated structure, so as to prevent gas from breaking into the cavitythrough the interface between two layers along the direction parallel to the surface of the substrate

MEMS element and electrical device using the same

A method for the production of a planar structure is disclosed. The method comprises producing on a substrate a plurality of structures of substantially equal height, and there being a space in between the plurality of structures. The method further comprises providing a fill layer of electromagnetic radiation curable material substantially filling the space between the structures. The method further comprises illuminating a portion of the fill layer with electromagnetic radiation, hereby producing a exposed portion and an unexposed portion, the portions being separated by an interface substantially parallel with the first main surface of the substrate. The method further comprises removing the portion above the interface.

Method for the production of planar structures

An interconnect module and a method of manufacturing the same. The method of making an interconnect module on a substrate comprises forming an interconnect section on the substrate. The interconnect section comprises at least two metal interconnect layers separated by a dielectric layer. The method further comprises forming a passive device on the substrate at a location laterally adjacent to the interconnect section. The passive device comprises at least one moveable element comprising a metal layer. The method further comprises forming the metal layer and one of the at least two metal interconnect layers from substantially the same material.

System for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules

One inventive aspect relates to a reconfigurable cavity resonator. The resonator comprises a cavity delimited by metallic walls. The resonator further comprises a coupling device for coupling an electromagnetic wave into the cavity. The resonator further comprises a tuning element for tuning a resonance frequency at which the electromagnetic wave resonates in the cavity. The tuning element comprises one or more movable micro-electromechanical elements with an associated actuation element located in their vicinity for actuating each of them between an up state and a down state. The movable micro-electromechanical elements at least partially have a conductive surface and are mounted within the cavity.

Reconfigurable cavity resonator with movable micro-electromechanical elements as tuning elements

A method is described for designing a micro electromechanical device in which the risk of self-actuation of the device in use is reduced. The method includes locating a first conductor in a plane and locating a second conductor with its collapsible portion at a predetermined distance above the plane. The method also includes laterally offsetting the first conductor by a predetermined distance from a region of maximum actuation liability. The region of maximum actuation liability is where an attraction force to be applied to activate the device is at a minimum.

Method for designing a micro electromechanical device with reduced self-actuation

Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules

A micro electromechanical switchable capacitor is disclosed, comprising a substrate, a bottom electrode, a dielectric layer deposited on at least part of said bottom electrode, a conductive floating electrode deposited on at least part of said dielectric layer, an armature positioned proximate to the floating electrode and a first actuation area in order to stabilize the down state position of the armature. The device may furthermore comprise a second actuation area. The present invention provides shunt switches and series switches with actuation in zones attached to the floating electrode area or with relay actuation.

Switchable capacitor and method of making the same

An interconnect module and a method of manufacturing the same is described comprising: a substrate, an interconnect section formed on the substrate, and a variable passive device section formed on the substrate located laterally adjacent to the interconnect section. The interconnect section has at least two metal interconnect layers separated by a dielectric layer and the variable passive device has at least one moveable element. The moveable element is formed from a metal layer which is formed from the same material and at the same time as one of the two interconnect layers. The moveable element is formed on the dielectric layer and is released by local removal of the dielectric layer. Additional interconnect layers and intermediate dielectric layers may be added.

Growing community of inventors

Maasmechelen, Belgium

Hendrikus Tilmans