Nxp B.v.

Macom Technology Solutions Holdings, Inc.

Hendrikus Johannes Jacobus Thoonen

Chris Wyland

Michael Everett Fangman

Thomas Robert Daugherty

Systems and methods are provided to align a first optical component carried by a first semiconductor chip with a second optical component carried by a second semiconductor chip. Each of the first semiconductor chip and the second semiconductor chip may include at least one primary semiconductor chip fiducial which assists in the alignment of the first optical component carried by a first semiconductor chip with a second optical component carried by a second semiconductor chip.

Optical component alignment system and method using plural fiducials

A thermal interface material facilitates heat transfer between an integrated circuit device and a thermally conductive device. According to an example embodiment, a thermal interface material includes carbon nanotube material that enhances the thermal conductivity thereof The interface material flows between an integrated circuit device and a thermally conductive device. The carbon nanotube material conducts heat from the integrated circuit device to the thermally conductive device.

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Nijmegen, Netherlands

Hendrikus Johannes Jacobus Thoonen