Infineon Technologies Ag

Helmut Wietschorke

Horst Theuss

Mathias Vaupel

Jochen Dangelmaier

Ulrich Krumbein

Markus Loehndorf

Stephan Schmitt

Berthold Astegher

Matthias Boehm

Stefan Martens

Tze Yang Hin

Steven Gross

Klaus Elian

Daniel Kehrer

Beng Keh See

Stefan Paulus

Albert Auburger

Werner Simbuerger

Cyrus Ghahremani

Thomas Lichtenegger

Jean Schmitt

Sebastian Beer

Beng-Keh See

The present disclosure relates to a magnetic-sensor device comprising a circuit board made of an electrically insulating material and having conductor tracks, and comprising a permanent magnet surface-mounted on the circuit board, and a magnetic-field sensor connected to the conductor tracks of the circuit board. An SMD component for populating a circuit board is also proposed, which SMD component comprises a permanent magnet and a magnetic-field sensor.

Magnetic-sensor device and method for producing same

A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.

Pressure sensor module having a sensor chip and passive devices within a housing

In various embodiments, a Hall sensor arrangement for the redundant measurement of a magnetic field may include a first Hall sensor on a top side of a first semiconductor substrate; a second Hall sensor on a top side of a second semiconductor substrate; a carrier having a top side and an underside; wherein the first Hall sensor is arranged on the top side of the carrier and the second Hall sensor is arranged on the underside of the carrier; and wherein the measuring area of the first Hall sensor projected perpendicularly onto the carrier at least partly overlaps the measuring area of the second Hall sensor projected perpendicularly onto the carrier.

Apparatus for redundantly measuring a magnetic field

A module and a method for manufacturing a module are disclosed. An embodiment of a module includes a first semiconductor device, a frame arranged on the first semiconductor device, the frame including a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity.

Module and method of manufacturing a module

A method for redundantly measuring a magnetic field for a sensor arrangement including a carrier having a first side and a second side, a first sensor disposed on a first semiconductor substrate on the first side of the carrier, and a second sensor disposed on a second semiconductor substrate on the second side of the carrier, the method including: sensing a component of a magnetic field perpendicular to the carrier with the first sensor and sensing the same component of the magnetic field perpendicular to the carrier with the second sensor.

Method for redundantly measuring a magnetic field

A pressure sensor package includes a lead and a semiconductor die spaced apart from the lead and including a terminal and a diaphragm disposed at a first side of the die. The die is configured to change an electrical parameter responsive to a pressure difference across the diaphragm. The package further includes an electrical conductor connecting the terminal to the lead, a molding compound encasing the electrical conductor, the die and part of the lead, a cavity in the molding compound exposing the diaphragm, and a sealing ring disposed on a side of the molding compound with the cavity. The sealing ring surrounds the cavity and has a lower elastic modulus than the molding compound. Alternatively, the sealing ring can be a ridge of the molding compound that protrudes from the side of the molding compound with the cavity and surrounds the cavity. A package manufacturing method is also provided.

Pressure sensor package with integrated sealing

Techniques for covering open-cavity integrated-circuit packages in a batch process are disclosed. In an example method, a plurality of open-cavity packages are molded on a single batch leadframe or substrate, each open-cavity package comprising a floor and a plurality of walls arranged around the floor to form a cavity, each of said the walls having a bottom end adjoining said floor and having a top side opposite the bottom end. At least one semiconductor device is attached to the floor and within the cavity of each of the open-cavity packages, and a single flexible membrane is affixed to the top sides of the walls of the plurality of open-cavity packages, so as to substantially cover all of the cavities. The flexible membrane is then severed, between the packages.

Film-covered open-cavity sensor package

Hall sensor arrangement for the redundant measurement of a magnetic field

A pressure sensor package includes a pressure sensor having a first side with a pressure sensor port, a second side opposite the first side, and electrical contacts. A logic die stacked on the pressure sensor has a first side attached to the second side of the pressure sensor and a second side opposite the first side with electrical contacts. The logic die is laterally offset from the electrical contacts of the pressure sensor and operable to process signals from the pressure sensor. Electrical conductors connect the electrical contacts of the pressure sensor to the electrical contacts of the logic die. Molding compound encapsulates the pressure sensor, the logic die and the electrical conductors, and has an opening defining an open passage to the pressure sensor port. External electrical contacts are provided at a side of the pressure sensor package.

Pressure sensor package having a stacked die arrangement

In one embodiment a method for manufacturing a semiconductor device comprises arranging a wafer on a carrier, the wafer comprising singulated chips; bonding the singulated chips to a support wafer, and removing the carrier.

Method of manufacturing a semiconductor device

An sensor includes a substrate with a magnetic field sensor mounted on the substrate. The magnetic field sensor has a first surface defining a plane. A magnetic flux conducting member has a second surface that is not parallel to the first surface. A non-magnetic member is situated between the magnetic field sensor and the magnetic flux conducting member.

Magnetic sensor integrated circuit device and method

A method of manufacturing a sensor module includes providing a substrate comprising a magnetically sensitive sensor element. The sensor element and the substrate are encapsulated with at least one mold material that is configured to apply a bias magnetic field to the sensor element.

Growing community of inventors

Laberweinting, Germany

Helmut Wietschorke