Siltronic Ag

Helmut Seehofer

Anton Huber

Peter Wiesner

Alexander Heilmaier

Manfred Schoenhofer

Engelbert Auer

Clemens Radspieler

A wire guide roll for use in wire saws for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece is provided with a coating having a thickness of at least 2 mm and at most 7.5 mm of a material which has a Shore A hardness of at least 60 and at most 99, and which contains a multiplicity of grooves through which the sawing wire is guided, the grooves each having a curved groove base with a radius of curvature which is 0.25-1.6 times the sawing wire diameter, and an aperture angle of 60-130&#xb0;. A multiplicity of wafers are simultaneously sliced from a cylindrical workpiece by a wire saw using such wire guide rolls.

Wire guide roll for wire saw and method

Slicing multiple cylindrical workpieces into wafers by a multi wire saw with a gang length L, is performed by: and making right-hand side of the inequality as large as possible, where Lwith i=1 . . . n are for the lengths of the workpieces and Ais a predefined minimum spacing, is satisfied,

Method for simultaneously slicing at least two cylindrical workpieces into a multiplicity of wafers

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Burghausen, Germany

Helmut Seehofer