Lsi Logic Corporation

Cypress Semiconductor Corporation

Helmut Puchner

Andrew J Walker

Sheldon Aronowitz

Shih-Fen Huang

Gary K Giust

Kevin Jang

Sagy Charel Levy

Igor Polishchuk

Ravindra Manohar Kapre

Suhail Zain

James P Kimball

Walt Anderson

Ruggero Castagnetti

Bill Phan

Nicholas K Eib

David W Still

Oliver Pohland

John Haywood

Weiran Kong

Sai Prashanth Dhanraj

Harold Kutz

Yauh-Ching Liu

Venkatesh P Gopinath

Vladimir Zubkov

Valeriy K Sukharev

James H Shutt

Sungkwon Lee

Ming-Yi Lee

Kaveh Shakeri

Shahin Sharifzadeh

Franklin Duan

Steven Michael Peterson

Karthik Navalpakam

Lee Phan

Ravindra A Kapre

Jaejune Jang

Nayan Patel

Kavin Jaejune Jang

Jeong-Yeop Nahm

Yangzhong Xu

A memory including current-limiting devices and methods of operating the same to prevent a spread of soft errors along rows in an array of memory cells in the memory are provided. In one embodiment, the method begins with providing a memory comprising an array of a plurality of memory cells arranged in rows and columns, wherein each of the columns is coupled to a supply voltage through one of a plurality of current-limiting devices, Next, each of the plurality of current-limiting devices are configured to limit current through each of the columns so that current through a memory cell in a row of the column due to a soft error rate event does not result in a lateral spread of soft errors to memory cells in the row in an adjacent column. Other embodiments are also provided.

Memory cell array latchup prevention

A memory cell includes a storage element coupled to a first data node and a second data node, a first programmable nonvolatile element and a second programmable nonvolatile element, a first switch element and a second switch element. The first switch element is configured to couple the first programmable nonvolatile element to the first data node during a first read mode of the memory cell. The second switch element is configured to couple the second programmable nonvolatile element to the second data node during the first read mode.

High reliability non-volatile static random access memory devices, methods and systems

A method includes forming a first oxide layer. The method further includes etching a portion of the first oxide layer using a first decoupled plasma nitridation process. The method includes forming, subsequent to the etching, a charge-trapping layer on the first oxide layer.

SONOS type stacks for nonvolatile charge trap memory devices and methods to form the same

A device can include an interface circuit configured to translate memory access requests at a controller interface of the interface circuit into signals at a memory device interface of the interface circuit that is different from the controller interface, the interface circuit including a write buffer memory configured to store a predetermined number of data values received at a write input of the controller interface, and a read buffer memory configured to mirror a predetermined number of data values stored in the write buffer memory; wherein the memory device interface comprises an address output configured to transmit address values, a write data output configured to transmit write data on rising and falling edges of a periodic signal, and a read data input configured to receive read data at the same rate as the write data.

Memory controller devices, systems and methods for translating memory requests between first and second formats for high reliability memory devices

A method for fabricating a nonvolatile charge trap memory device is described. The method includes forming a first oxide layer on a surface of a substrate. The first oxide layer is exposed to a first decoupled plasma nitridation process having a first bias. Subsequently, a charge-trapping layer is formed on the first oxide layer. The charge-trapping layer is exposed to an oxidation process and then to a second decoupled plasma nitridation process having a second, different, bias.

SONOS type stacks for nonvolatile changetrap memory devices and methods to form the same

A device can include a plurality of memory cells, each memory cell including at least one latch circuit coupled between two data nodes, a first nonvolatile section coupled to a first data node, and a second nonvolatile section coupled to a second data node; and each nonvolatile section including at least one switch element in series with a programmable nonvolatile element, the switch element configured to couple the nonvolatile element to the corresponding data node during a high reliability read operation of the memory cell.

A circuit with electrostatic discharge protection is described. In one case, the circuit includes trigger device configured to protect a component connected to a node of the circuit during an electrostatic discharge event, the trigger device includes an isolation structure interposed between a gate oxide layer and an extended drain region. A portion of the extended drain region proximate the isolation structure is substantially metal-free.

Circuit with electrostatic discharge protection

A voltage protection device and method is provided to prevent accidental triggering of an silicon-controlled rectifier (SCR) unless the electrostatic discharge (ESD) is at a predefined threshold above the normal power supply operating voltage or below the ground supply operating voltage. The holding voltage upon the SCR is maintained above the threshold voltage to prevent accidental triggering. The present SCR avoids use of an additional field effect transistor (FET), and avoids relying upon the breakdown of the drain terminal of the FET, but instead programs the amount of holding voltage needed above the power supply voltage using mask-programmability, fuses, or other means for maintaining the holding voltage to a desired range above the power supply voltage. The programmed holding voltage is implemented using a barrier region between the PNP and the NPN of the PNPN junctions of the SCR. In addition to or as an alternative to the barrier region, hole sink junctions can be implemented close to the anode to reduce the substrate resistance in the vicinity of the anode and, therefore, extract holes from their normal target destination.

Voltage protection device

SONOS type stacks for nonvolatile change trap memory devices and methods to form the same

A circuit with electrostatic discharge protection is described. The circuit includes an output driver transistor with an extended drain contact region. The circuit also includes a distinct device configured to provide electrostatic discharge protection for the output driver transistor. The distinct device includes an electrostatic discharge protection transistor with an extended drain region.

A protection circuit and method are provided for protecting semiconductor devices from electrostatic discharge (ESD). Generally, the ESD protection circuit includes a silicon controlled rectifier (SCR) formed in a substrate and configured to transfer charge from a protected node to a negative power supply, V, during an ESD event, and a trigger device to activate transfer of charge by the SCR when a voltage on the protected node reaches a predetermined trigger voltage. The trigger device includes a gated-diode and MOS capacitor formed in a well formed in the substrate, the trigger device configured to inject electrons into the well during charging of the MOS capacitor, forward biasing a node of the SCR, hence allowing fast triggering of the SCR device. The trigger voltage can be set independent of a holding voltage by adjusting the length of the well and area of the capacitor. Other embodiments are also disclosed.

Capacitor triggered silicon controlled rectifier

A regulated circuit having a number of metal-oxide-semiconductor field effect transistors (MOS FETs) and a method for using the same are provided to reduce Negative Bias Temperature Instability degradation of the MOS FETs on the circuit. In one embodiment, the method involves steps of: (i) detecting degradation in performance of at least one of the MOS FETs causing a shift in threshold voltage (V) of the MOS FET; and (ii) if the shift in Vexceeds a predetermined value, forward biasing the MOS FETs, thereby reducing or reversing the shift in V. Optionally, the method includes an initial step of determining if the circuit is in a non-dynamic operating mode before forward biasing the MOS FETs. Other embodiments are also disclosed.

Method and circuit for reducing degradation in a regulated circuit

A diode, includes a semiconductor substrate, a first region doped with a first dopant type in the substrate, a second region doped with a second dopant type in the substrate, a first well of the first dopant type in the substrate and surrounding the first region and the second region, and a second well of the second dopant type in the substrate connecting the first region and the second region. The first dopant type is opposite the second dopant type.

High voltage diode

Non-volatile (NV) semiconductor memories and methods of operating the same to reduce or eliminate a need for an external capacitance are provided. In one embodiment, the memory includes a memory cell comprising a random access memory (RAM) portion and a NV memory portion, and the method comprises steps of: (i) initially erasing the NV memory portion; and (ii) on detecting a drop in power supplied to the memory, programming the NV memory portion with data from the RAM portion while powering the memory from a capacitor. On restoration of power data is recalled from the NV memory portion into the RAM portion, and the NV memory portion erased. Preferably, the capacitor is integrally formed on a single substrate with the NV memory portion and RAM portion. More preferably, the capacitor comprises intrinsic capacitance between elements of the memory formed on the substrate. Other embodiments are also disclosed.

Non-volatile memory and method of operating the same

Growing community of inventors

Santa Clara, CA, United States of America

Helmut Puchner