Electrovac, Fabrikation Elektrotechnischer Spezialartikel Gesellschaft

Electrvac, Fabrikation Elektrotechnischer Spezialartikel Gmbh

Helmut Nechansky

Theodore Nicolas Schmitt

Benno Lux

Hermann Holzer

Theodor Schmitt

Roland Haubner

A composite structure includes a first nonmetallic component and a second mponent of metal or nonmetal, with the first and second components being joined together by a bonding material which is so introduced by way of a casting process as to permeate to an area between the first and second components.

Composite structure, and method of making same

A method of depositing a polycrystalline diamond layer on a nitride substrate is disclosed, which comprises chemically-etching the nitride substrate with a KOH or NaOH solution or melt and depositing the polycrystalline diamond layer on the nitride substrate from a vapor phase, wherein the etching temperature, time and concentration of the etchant are controlled so that at least 75% of the interface between the substrate and the diamond layer is covered by diamond crystals, each diamond crystal having a contact area with the substrate of .gtoreq.20 um.sup.2.

Method of depositing a polycrystalline diamond layer on a nitride

A process of making a casing having at least one open end and formed with electric conducting passages and connections for electronic components or switching circuits, includes the following steps: preparing a formed body, made of ceramics, glass, glass-ceramics, metal or silicon carbide, with passageways in form of bores and/or indentations, placing the formed body in a mold and pouring liquid metal in the mold to surround the formed body, thereby filling the first passageways, and removing metal from the formed body to leave metal only in the first passageways.

Method of making a casing for receiving electronic components or

A circuit board includes a substrate of ceramic material and conductive strips in form of a metal layer which is cast onto the surface of the substrate and formed through locally stripping metal layer from the substrate surface. The circuit board further includes a recess for receiving an inlay of metal matrix composite material.

Growing community of inventors

Vienna, Austria

Helmut Nechansky