Robert Boschgmbh

Robert Bosch Gmbh

Robert Bosh Gmbh

Helmut Grutzeck

Joerg Muchow

Frederic Njikam Njimonzie

Rainer Straub

Johannes Baader

Simon Armbruster

Jochen Franz

Stefan Pinter

Frank Schatz

Zoltan Lestyan

Conrad Haeussermann

Andreas Duell

Uwe Schiller

Klaus Kasten

Johann Wehrmann

Michael Munz

Sebastian Reiss

Stefan Zehringer

Stefan Mark

Jochen Reinmuth

Thorsten Balslink

Volkmar Senz

Timo Schary

Arne Dannenberg

Kerrin Doessel

Mike Schwarz

Renate Mueller

Hubert Benzel

Thomas Friedrich

Mirko Hattass

Anton Dukart

Stefan Leidich

Lars Tebje

Daniel Maier

Wolfgang Heinzelmann

Philip Kaupmann

Andreas Finn

Konrad Dirscherl

Friedjof Heuck

Odd-Axel Pruetz

Robert Maul

Patrick Wellner

Mohamad Iyad Al Dibs

Hendrik Specht

Christian Patak

Michaela Mitschke

Wolfram Schock

Peter Sudy

Corinna Koepernik

Stephan Oppl

Heiko Nitsche

Ferenc Lukacs

Volker Materna

Josip Mihaljevic

Massimiliano Putignano

Soeren Zimmermann

Stefan Liebing

Tamas Dögei

Stefan Thomas Jaeger

A micromechanical oscillation system. The micromechanical oscillation system has a micromechanical oscillating body having at least one micromirror. In addition, the micromechanical oscillation system includes an electromagnetic drive unit which has a coil body and at least one magnet. The coil body essentially extends laterally to the micromirror. The at least one magnet extends underneath the coil body.

Micromechanical oscillation system

A gas sensor for detecting a physical and/or chemical value of an analysis gas, a corresponding manufacturing method, and operating method. The gas sensor is based on the principle of a thermal conductivity measurement with the aid of a sensor structure including a double meander structure made up of two resistor lines, as part of a Wheatstone bridge circuit, on a diaphragm of a substrate. The two resistor lines are energized in opposite directions as a function of the detected temperature. The physical and/or chemical value(s) of the analysis gas are/is subsequently determined as a function of the voltages detected at the double meander structure.

Gas sensor, manufacturing method, and detection method

A sensor for measuring a concentration of an analysis fluid based on a thermal conductivity principle. The sensor includes at least one analysis heating element, situated on a measuring diaphragm, for heating the analysis fluid, and a reference heating element, situated on a reference diaphragm, for heating at least one reference gas. The measuring diaphragm and the reference diaphragm are adjacently situated between a sensor substrate and a cap substrate. The measuring diaphragm is situated in a measuring volume and the reference diaphragm is situated in a reference volume. The measuring diaphragm and the reference diaphragm each include at least one coating. The measuring diaphragm is opened by at least one clearance. A method for manufacturing a sensor is also described.

Sensor, including a diaphragm that is open through a clearance, for measuring the concentration of an analysis fluid

A micromechanical sensor includes a substrate having a cavity; a flexible diaphragm spanning the cavity; and a lever element that spans the diaphragm and has a first and second end section on opposite sides of a center section. A first joint element is between the first end section and the substrate and a second joint element is between the center section and the diaphragm. The lever element can be pivoted due to a deflection of the diaphragm. Two capacitive sensors are provided, each having two electrodes, one electrode of each sensor being mounted at one of the end sections of the lever element, and the other being mounted on the substrate. The electrodes are disposed so that distances between the electrodes of different sensors are influenced oppositely when the lever element is pivoted. Also, an actuator is provided for applying an actuating force between the lever element and the substrate.

Linearized micromechanical sensor

A micromechanical micromirror array including a frame including a cutout, a micromirror device suspended on the frame in the area of the cutout in a first plane, a first pivoting vane device suspended on the frame protruding into the area of the cutout, coupled to the micromirror device via a first spring device, a second pivoting vane device suspended on the frame protruding into the area of the cutout, coupled to the micromirror device via a second spring device, a first drive device for deflecting the first pivoting vane device along a first axis, perpendicular to the first plane, and a second drive device for the antiphase deflection of the second pivoting vane device along the first axis.

Micromechanical micromirror array and corresponding operating method

A micromechanical component having a mount, an adjustable element, which is connected via at least one spring to the mount, and an actuator device, a first oscillatory motion of the adjustable element about a first axis of rotation and simultaneously a second oscillatory motion of the adjustable element, which is set into the first oscillatory motion, being excitable about a second axis of rotation in response to the actuator device; and the adjustable element being configured by the at least one spring to be adjustable on the mount in such a way that the adjustable element is adjustable by a resulting angular momentum about a rotational axis, which is oriented orthogonally to the first axis of rotation and orthogonally to second axis of rotation. Also, a method for manufacturing a micromechanical component. Moreover, a method for exciting a motion of an adjustable element about a rotational axis.

Micromechanical component having an oscillator, a method for the manufacture thereof, and a method for exciting a motion of an adjustable element about a rotational axis

A micromechanical pressure sensor, having&#x2014;a pressure sensor core including a sensor diaphragm and a cavity developed above the sensor diaphragm; and&#x2014;a pressure sensor frame; and&#x2014;a spring element for the mechanical connection of the pressure sensor core to the pressure sensor frame being developed in such a way that a mechanical robustness is maximized and a coupling of stress from the pressure sensor frame into the sensor pressure core is minimized.

Micromechanical pressure sensor

A micromechanical component having a mounting support, at least one coil winding held by at least one coil brace and comprising conductor tracks made from at least one electrically conductive material, at least one first subsection of the at least one coil winding being anchored on the associated coil brace, and an adjustable part, the at least one coil brace and the adjustable part being connected to each other and via at least one spring element to the mounting support in such a way that the adjustable part is adjustable about at least one axis of rotation in relation to the mounting support, and, while the at least one first subsection of the at least one coil winding is anchored on the associated coil brace, at least one second subsection of the same coil winding spans at least one gap formed in the associated coil brace as a cantilever subsection.

Micromechanical component and method for producing a micromechanical component

A micromirror device, including a substrate and an outer frame element, which is connected to the substrate along a first oscillating axis with the aid of a first suspension device, and is deflectable about the first oscillating axis. In addition, the micromirror device includes an inner frame element, which is connected to the outer frame element along the first oscillating axis with the aid of a second suspension device; as well as an oscillating plate, which includes a micromirror and is connected to the inner frame element along a second oscillating axis, with the aid of a third suspension device; the first oscillating axis being perpendicular to the second oscillating axis. The inner frame element includes displaceable deflection elements, the oscillating plate being deflectable by displacing the deflection elements relative to the outer frame element.

Micromirror device and method for operating a micromirror device

A micromechanical component includes a micromirror connected to a mounting support via at least one spring such that the micromirror is adjustable about at least one axis of rotation relative to the mounting support, where the micromirror includes a reflective surface developed at least partially on a first diaphragm surface of a mounted diaphragm of the micromirror, the diaphragm including a second diaphragm surface that faces away from the first diaphragm surface and that is mounted in air or vacuum.

A micromirror device having a cap, a function layer, and a window layer, which are disposed on top of one another and parallel to a main extension plane, the function layer being situated between the cap and the window layer, and a micromirror is patterned out of the function layer. The micromirror device has a stop, which is designed to restrict a deflection of the micromirror in a direction perpendicular to the main extension plane.

Micromirror device having a mechanical stop

A micromechanical device and a corresponding manufacturing method. The micromechanical device includes: a spring element which is moveably coupleable or is moveably coupled to a frame unit at at least one connecting point of the spring element, the spring element including at least one web, which extends outward from the at least one connecting point; and the at least one web being structured in such a way that it includes at least one first section as well as at least one widening section for reducing a non-linearity of the spring element, which is widened compared to the first section.

Micromechanical spring device and method for manufacturing a micromechanical spring device

A micromechanical component including a mounting support, a coil winding retained by a coil brace, and an adjustable part, the coil brace and the adjustable part being connected to each other and via at least one spring element with the mounting support in such a way that the adjustable part is adjustable relative to the mounting support about at least one axis of rotation, and a stop support being fixedly disposed or developed on the mounting support and being at least partially framed by the coil brace, which stop support has at least one first stop area protruding on a surface of the mounting support, which limits a relative movement at least of the coil brace in at least one direction relative to the mounting support by a contact of the at least one first stop area with the coil brace.

A micromechanical component including a mounting including a spanned diaphragm, which is warpable via a pressure difference between a first diaphragm side and a second diaphragm side against a diaphragm counter force according to a diaphragm spring constant of the diaphragm, and at least one actuator electrode, which is connected to the diaphragm and adjustable against a spring force according to at least one spring constant of at least one spring with the aid of a warping of the diaphragm, an overall system spring constant being definable as the sum of a diaphragm spring constant of the diaphragm and the spring constant of the single spring, or an overall spring constant of all springs, via which the at least one actuator electrode is connected to the mounting, and the spring constant of the single spring or of all springs being at least 5% of the overall system spring constant.

Micromechanical component including diaphragm, manufacturing method for such a component and method for operating a pressure sensor

A mechanical component has: a mounting; a movable part which, with the aid of at least one first spring and one second spring, is connected to the mounting in such a way that the movable part is movable about a rotational axis extending through a first anchoring area of the first spring on the mounting and a second anchoring area of the second spring on the mounting; a first sensor device with at least one first resistor which is situated on and/or in the first spring; and a second sensor device with at least one second resistor situated on and/or in the second spring. The first sensor device includes a first Wheatstone half bridge and the second sensor device includes a second Wheatstone half bridge. The first and second Wheatstone half bridges are connected to form a Wheatstone full bridge.

Mechanical component and manufacturing method for a mechanical component

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Kusterdingen, Germany

Helmut Grutzeck