Aeg Isolier- Und Kunststoff Gmbh

Licentia Patent-verwaltungs Gmbh

Helmut Fasbender

Johann Wartusch

Horst Hirschfeld

Adhesion imparting layer applied to an insulating material serving as a base material in the production of printed circuit boards. The adhesion imparting layer consists essentially of an elastomer of acrylonitrile-butadiene copolymer cross-linked with an organic peroxide.

Adhesion imparting layer of acrylonitrile-butadiene copolymer on a base

In a process for making a printed circuit, a method of forming a base for the circuit, including coating a cover foil with a decomposable film, then bonding the film to a carrier, and then removing the cover foil from the film. A protected base useful for making printed circuits, comprising a synthetic-resin-based carrier, a decomposable adhesive film bonded to the carrier, and a removable cover foil bonded to the film, the adhesive film containing catalyst effective for the electroless deposition of metal conductors.

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Kassel, Germany

Helmut Fasbender