Siemens Aktiengesellschaft

Helmut D&ouml;rfler

Sebastian Raith

Heiko Mueller

A circuit carrier ( ) (printed circuit board ) has two metallic outer layers ( ) and at least one metallic intermediate layer ( ). Insulating layers ( ) are arranged between the outer layers ( ) and the intermediate layer ( ). A component ( ) to be cooled and a cooling element ( ) are arranged on the outer layers ( ). The cooling element ( ) is thermally coupled to the component ( ) to be cooled via a heat conducting path. The heat conducting path runs partly in the intermediate layer ( ). Heat is transferred transversely in said path.

Growing community of inventors

Erlangen, Germany

Helmut Dörfler

Growing community of inventors

Erlangen, Germany

Helmut D&ouml;rfler

Helmut Dörfler