U.S. Philips Corporation

Philips Electronics N.v.

Helmut Bruckner

Werner Uggowitzer

Siegfried Kopnick

Process for manufacturing a printed circuit board and printed circuit

Two-layer or multilayer printed circuit board, method of manufacturing such a printed circuit board, and laminate for the manufacture of such a printed circuit board by such a method. A two-layer or multilayer printed circuit board (1) comprises a support plate (2) which consists of a basic material and which carries a first conductor pattern (3) and a second conductor pattern (17) connected to the support plate (2) via an adhesive layer (11)consisting of an electrically insulating adhesive material. At least one opening (12, 13) is provided in the adhesive layer (1 1), which opening leads to a connecting section (4, 5) of the first conductor pattern (3) and to which a connecting section (18, 19) of the second conductor pattern (17) extends, and by means of which the connecting sections (4, 5, 18, 19) of the two conductor patterns (3, 17) can be electrically interconnected by means of an electrically conducting material connection (28, 29). The adhesive layer (11) consists of an adhesive material which in a certain temperature range has a higher hardness than the region (2a) of the support plate (2) adjoining the first conductor pattern (3 ), and the first conductor pattern (3) is pressed into the support plate (2) by the adhesive layer (11) exclusively in its region covered by the adhesive layer (11) as a result of a pressing process for joining together the adhesive layer (11) and the support plate (2), while the region of each connecting section (4, 5) of the first conductor pattern (3) surrounded by an opening (12, 13) is given a curved shape in the direction of a connecting section (18, 19) of the second conductor pattern (17).

Method of manufacturing a multilayer printed circuit board having first

A two-layer or multilayer printed circuit board (1) comprises a support plate (2) which consists of a basic material and which carries a first conductor pattern (3) and a second conductor pattern (17) connected to the support plate (2) via an adhesive layer (11) consisting of an electrically insulating adhesive material. At least one opening (12, 13) is provided in the adhesive layer (11), which opening leads to a connecting section (4, 5) of the first conductor pattern (3) and to which a connecting section (18, 19) of the second conductor pattern (17) extends, and by means of which the connecting sections (4, 5, 18, 19) of the two conductor patterns (3, 17) can be electrically interconnected by means of an electrically conducting material connection (28, 29). The adhesive layer (11) consists of an adhesive material which in a certain temperature range has a higher hardness than the region (2a) of the support plate (2) adjoining the first conductor pattern (3 ), and the first conductor pattern (3) is pressed into the support plate (2) by the adhesive layer (11) exclusively in its region covered by the adhesive layer (11) as a result of a pressing process for joining together the adhesive layer (11) and the support plate (2), while the region of each connecting section (4, 5) of the first conductor pattern (3) surrounded by an opening (12, 13) is given a curved shape in the direction of a connecting section (18, 19) of the second conductor pattern (17).

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Eitorf, Austria

Helmut Bruckner