Intel Corporation

Helme Castro De La Torre

Aleksandar Aleksov

Kristof Darmawikarta

Suddhasattwa Nad

Darko Grujicic

Sashi S Kandanur

Rengarajan Shanmugam

Marcel A Wall

Thomas I Sounart

Glass substrates having transverse capacitors for use with semiconductor packages and related methods are disclosed. An example semiconductor package includes a glass substrate having a through glass via between a first surface and a second surface opposite the first surface. A transverse capacitor is located in the through glass via. The transverse capacitor includes a dielectric material positioned in a first portion of the through glass via, a first barrier/seed layer positioned in a second portion of the through glass via, and a first conductive material positioned in a third portion of the through glass via.

Glass substrates having transverse capacitors for use with semiconductor packages and related methods

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Gilbert, AZ, United States of America

Helme Castro De La Torre