Apple Inc.

Helia Rahmani

Anthony D Minervini

Zhiyong Cedric Xia

Stephen Vincent Jayanathan

Zijing Zeng

Charley T Ogata

David Sheldon Schultz

James C Clements

Prithu Sharma

Jiandong Yu

Scott J Campbell

Wanfeng Huang

Christian Kettenbeil

Vineet Negi

Stephane J Marcadet

Structures, methods, and apparatus for protecting interconnections between components and boards in an electronic device from damage resulting from a physical shock. This damage can occur due to differential tensile forces being applied between the component and the board during a drop or other shock event. An example can reduce or prevent damage by providing differential compression forces between the component and board that can cancel differential tensile forces between the component and board during the shock event. Another example can reduce or prevent damage by reducing differential tensile forces between a component and board. Another example can secure a component to the board to directly reduce the differential force in order to prevent damage.

Compression structures for IC packages

Embodiments described herein are directed to a temperature measurement device that includes a sensor body configured to be placed on a skin of a user. The temperature measurement device can include a first section defining a first lower surface and having a first thickness, a second section defining a second lower surface and having a second thickness, and a channel separating the first lower surface from the second lower surface. The temperature measurement device can also include a first set of temperature sensors positioned across the first thickness, a second set of temperature sensors positioned across the second thickness, and a processor configured to estimate a tissue temperature of the user based on comparing temperature signals from the first set of temperature sensors with temperature signals from the second set of temperature sensors.

Miniature external temperature sensing device for estimating subsurface tissue temperatures

Trace transfer techniques can be used to couple touch electrodes to touch sensing circuitry with a reduced border region around a touch sensor panel. Touch electrodes on a first side of the substrate can be routed to a bond pad region on the second side of the substrate via a trace transfer technique to enable single-sided bonding of a double-sided touch sensor panel. Trace transfer techniques can also be used to couple conductive traces on a first side of the substrate to a flex circuit oriented perpendicular to or otherwise not parallel to the first side of the substrate. Orienting the flex circuit in this way can allow the flex circuit to connect to touch circuitry with reduced bending as compared with the amount of bending of the flex circuit when oriented substantially parallel to the substrate.

Trace transfer techniques for touch sensor panels with flex circuits

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Mountain View, CA, United States of America

Helia Rahmani