Hoechst Aktiengesellschaft

Kalle, Niederlassung Der Hoechst Ag

Helga Sikora

Walter Herwig

Kurt Erbes

Rudolf Decker

Ulrich Geissler

Kurt Walter Klupfel

Heide Sprengel

The present invention relates to a photosensitive transfer material, which comprises a flexible temporary support film which is preferably transparent, a thermoplastic photosensitive layer, optionally a flexible cover film on the free side of the photosensitive layer and, optionally, an intermediate layer between the support film and the photosensitive layer. The photosensitive transfer material is suitable for manufacturing photoresist stencils and solder masks. The temporary support film has a rough surface which exerts an embossing effect on the surface of the photosensitive layer and the intermediate layer, respectively. The mat-finish of the intermediate layer prevents an irregular deformation of this layer in moist air, while the mat-finish of the photosensitive layer precludes unwanted reflections.

Photosensitive transfer material having a support of defined roughness

A radiation-polymerizable mixture comprising a compound having at least two terminal ethylenically unsaturated groups which can form a crosslinked polymer by means of free-radical initiated addition polymerization, a polymeric binder, a radiation activatable polymerization initiator, and a compound having two epoxy groups in the molecule and a molecular weight of not more than 1,500; and a photopolymerizable copying material having a flexible transparent temporary support and a transferrable thermoplastic photopolymerizable layer comprising the above-described radiation-polymerizable mixture.

Radiation-polymerizable mixture and photopolymerizable copying material

A polyurethane corresponding to the formula: ##STR1## wherein Q is a divalent, mononuclear or dinuclear aromatic radial which is unsubstituted or is substituted by lower alkyl groups and which can contain, as a linking member, a lower alkylene group,

Elastomeric, ethylenically unsaturated polyurethanes and radiation

A process and an aqueous treatment solution for cleaning copper surfaces, in particular for removing residues of photoresist layers, which residues still adhere after development to the cleared copper areas, are described. The solution contains a water-soluble aliphatic sulfonic acid having 8 to 30 carbon atoms or a water-soluble salt thereof.

Growing community of inventors

Wiesbaden, Germany

Helga Sikora