International Business Machines Corporation

Helen L Yeh

Ho-Ming Tong

Claudius Feger

Michael J Palmer

Alphonso Philip Lanzetta

Teresita Ordonez Graham

Kurt R Grebe

Linda C Matthew

Charles H Wilson

John J Liutkus

Nelson R Tanner

Kamalesh K Srivastava

Judith Marie Roldan

Chin-An Chang

Nicholas G Koopman

Steven Strickman

Vlasta A Brusic

John J Ritsko

Modest M Oprysko

Alina Deutsch

David W Sissenstein, Jr

Laura Beth Rothman

Peter J Elmgren

Charles J Owen

Atilio Zupicich

A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by application of special coatings to lead areas of the flex tape.

Coated means for connecting a chip and a card

Method of applying flex tape protective coating onto a flex product

The present invention relates to an improved flex (or TAB) product suitable for silicon carrier or other types of chip carrier applications, wherein the flex reliability problems caused for example by Cu thermal cycling are substantially reduced or eliminated. More particularly, the invention embodies a number of coatings for use in such products and diverse methods of making and using same.

Flex tape protective coating

The fluxless bonding in a reducing atmosphere of integrated circuit contacts containing copper is enhanced using a layer of 200 to 1500 Angstrom thick palladium which inhibits copper oxide formation before fusion and reduces all oxides to promote wetting during fusion.

Palladium enhanced soldering and bonding of semiconductor device contacts

Palladium enhanced fluxless soldering and bonding of semiconductor

A thin film region 14 of a multichip carrier 10 is provided with at least one fabrication process or tooling monitor for monitoring the quality of the fabrication process during the sequential formation of the layers of the region 14. The process monitor is formed with a desired layer or layers of the thin film region, such as by a photolithographic process. A centrally disposed active wiring region 30 of a layer is surrounded by peripherally disposed fabrication monitor sites 32. The sites 32 can be located such that they do not occupy or interfere with the surface area required for the wiring region 30 while still being disposed near enough to the wiring region such that the electrical and physical characteristics of the thin film is substantially the same. Four different types of thin film fabrication process monitors are disclosed, including a line/via monitor, a dielectric monitor, a laser assisted repair monitor and a laser assisted engineering change monitor.

In-line process monitors for thin film wiring

A workpiece is joined to a substrate by employing solder and applying diol and/or polyol and/or ether derivative thereof to the substrate. The workpiece is placed in contact with the diol and/or polyol and the resulting assembly is heated in a reducing atmosphere.

Reduction atmosphere workpiece joining

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Katonah, NY, United States of America

Helen L Yeh