Infineon Technologies Ag

Heinz Opolka

Paul-Werner Von Basse

Thomas Scheiter

Reinhard Fischbach

Thorsten Sasse

Thomas Fischer

Domagoj Siprak

Christian Peters

Michael Melzl

Werner Kröninger

Manfred Frank

Klaus Hammer

Reinhard G&ouml;llner

Siegfried Röhl

Markus Witte

Justin Bierner

Renate Köpnick

Richard Hummel

Rainer Grossmann

Andreas Gaymann

Thomas Rosteck

A method for manufacturing a chip is disclosed. The method comprises forming a material structure in a kerf adjacent the chip on a wafer. The method further comprises selectively removing the material structure in the kerf and dicing the wafer. A semiconductor wafer is disclosed. The semiconductor wafer comprises a plurality of chips and a plurality of kerfs. The kerfs separate the chips from each other. At least one kerf comprises a kerf framing. The kerf framing is arranged directly adjacent a side of the at least on chip.

Material structure in scribe line and method of separating chips

A conductor layer is patterned into flat portions, for example of a fingerprint sensor that effects capacitive measurement. The conductor layer is fragmented in a lattice-like manner by cutouts so that an applied passivation layer rests on a base layer that is present beneath the conductor layer. The interlaminar shear strength of the passivation is increased in this way.

Passivation layer structure

To increase the scratch resistance of a surface passivation, in particular, for fingerprint sensors, a antifrictional layer is applied to reduce the shearing forces. The antifrictional layer includes fat, oil, surfactants and/or wax. The antifrictional layer is preferably an emulsion including water, paraffin oil, propylene glycol, stearic acid, palmitic acid, TEA, beeswax, carbormer 954, methylparaben, propylparaben and possibly perfume.

Scratch-resistant coating for a semiconductor component

An electronic component is described and has a dielectric layer which is constructed on a substrate, conductive surfaces that are constructed on the dielectric layer, and an electrically conductive guard structure. The guard structure is disposed in a plane above the conductive surfaces such that the conductive surfaces are not completely covered by the guard structure.

Electronic component and utilization of a guard structure contained therein

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Wuppertal, Germany

Heinz Opolka