International Business Machines Corporation

Heinz O Steimel

Ananda H Kumar

George Czornyj

Kenneth Chang

Mukta S Farooq

Rao R Tummala

Nunzio DiPaolo

Richard A Bates

Nanik Bakhru

Suryanarayana Mukkavilli

Marvin S Pitler

A method of making a multilayer thin film structure on the surface of a dielectric substrate which includes the steps of:

Method of making a multilayer thin film structure

The present invention provides a packaging semiconductor structure and method for obtaining same. The structure is comprised of at least one level of dielectric and metallurgy layers. The at least one level is comprised of a wiring metallurgy plane and a 'through-via' plane of interconnecting metallurgy in association with both one and two layers of polymeric dielectric materials. The self-alignment method of fabrication of the level provides a streamlined technique wherein stringent masking and alignment requirements are relaxed, undue processing such as at least one polishing step is eliminated and a structure having adhesive integrity is fabricated.

Layer thin film wiring process featuring self-alignment of vias

Disclosed is a ceramic substrate having a protective coating on at least one surface thereof which includes:

Ceramic substrate having a protective coating thereon and a method for

Multi layer thin film wiring process featuring self-alignment of vias

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Fishkill, NY, United States of America

Heinz O Steimel