Freescale Semiconductor,inc.

Nxp USA, Inc.

Heinz Loreck

Keith L Kraver

Lianjun Liu

Yizhen Lin

Mark Edward Schlarmann

Hemant D Desai

Woo Tae Park

Gary G Li

Lisa H Karlin

Deyou Fang

Mike A Margules

A micro-electromechanical systems (MEMS) transducer () is adapted to use lateral axis vibration to generate non-planar oscillations in a pair of teeter-totter sense mass structures () in response to rotational movement of the transducer about the rotation axis () with sense electrodes connected to add pickups (e.g.,) diagonally from the pair of sense mass structures to cancel out signals associated with rotation vibration.

Vibration robust x-axis ring gyro transducer

Systems and methods are provided for monitoring operation of MEMS accelerometers (). In these embodiments a control loop () having a forward path () is coupled a MEMS transducer (), and a test signal generator () and test signal detector () is provided. The test signal generator () is configured to generate a test signal and apply the test signal to the forward path () of the control loop () during operation of the MEMS accelerometer transducer (). The test signal detector () is configured to receive an output signal from the control loop and detect the effects of the test signal in the output signal. Finally, the test signal detector () is further configured to generate a monitor output indicative of the operation of the sensing device to provide for the continuous monitoring of the operation of the MEMS accelerometer ().

System and method for monitoring an accelerometer

A device structure is made using a first conductive layer over a first wafer. An isolated conductive region is formed in the first conductive layer surrounded by a first opening in the conductive layer. A second wafer has a first insulating layer and a conductive substrate, wherein the conductive substrate has a first major surface adjacent to the first insulating layer. The insulating layer is attached to the isolated conductive region. The conductive substrate is thinned to form a second conductive layer. A second opening is formed through the second conductive layer and the first insulating layer to the isolated conductive region. The second opening is filled with a conductive plug wherein the conductive plug contacts the isolated conductive region. The second conductive region is etched to form a movable finger over the isolated conductive region. A portion of the insulating layer under the movable finger is removed.

Device structures for in-plane and out-of-plane sensing micro-electro-mechanical systems (MEMS)

Growing community of inventors

Tempe, AZ, United States of America

Heinz Loreck