Siemens Aktiengesellschaft

Heinz Hacker

Wolfgang Kleeberg

Klaus-Robert Hauschildt

Hubert Aulich

Klaus Kretzschmar

Dieter Wilhelm

Nikolaos Douklias

Jens Nordmann

Ernst Helwig

Josef Grabmaier

Guenter Zeidler

Walter Ihlein

Wilfried Haas

Hans-Georg Hauschildt

Willi Mertens

Heinz-Klaus Laupenmuhlen

Heinz K Laupenmuhlen

Polymer material

The invention provides epoxy resins having the following structure: ##STR1## The cross-linked epoxy resins have non-linear optical properties. The group 'Z' constitutes a nonlinear optical chromophone having stilbene, azo, azomethine or propargyl moieties as linking units.

Cross-linked epoxy resins with non-linear optical properties

The epoxy resins according to the invention demonstrate the following structure: ##STR1## The cross-linked epoxy resins exhibit non-linear optical properties.

Molding compounds for encapsulating semiconductor components comprise filler-containing polyepoxy resins and a 1,3,5-tris(3-amino-4-alkylphenyl)-2,4,6-trioxohexahydrotriazine with a C.sub.1 to C.sub.4 alkyl radical as a hardener. The molding compounds are storage-stable and moldings manufactured therefrom meet the requirements for these materials.

Epoxy resin molding compounds

Prepregs can be prepared by impregnating reinforcement materials such as glass, carbon or plastic (in the form of fibers or nonwoven or woven materials) with a solution of a polyepoxy resin and a polyamine as a hardener and subsequent drying. For the manufacture of storage-stable prepregs based on polyepoxy resins, 1,3,5-tris(3-amino-4-alkylphenyl-2,4,6-trioxo-hexahydrotriazine with a C.sub.1 - to C.sub.4 alkyl radical is used as the hardener. The new method leads to storage-stable prepregs and assures that composite materials, especially circuit boards, manufactured therefrom meet the requirements for these materials.

Method for the manufacture of prepregs and their use

Electrically insulating composite materials formed from (1) epoxy resins and (2) polymeric fiber reinforcement which have high strength are formed if the cross-linking of the epoxy resin is accomplished by anionic polymerization using tertiary amines of the formula ##STR1## as catalyst.

Method for manufacturing electrical insulating composite materials

The invention relates to reaction resins formed from anionically polymerizable di- or tri-functional epoxy compounds which are suitable for impregnating and/or casting large-volume parts. Such reaction resins therefore contain tertiary amine polymerization catalysts of the general formula ##STR1## in a concentration of 0.5 to 10 mass parts, relative to 100 mass parts epoxy compound.

Reaction resins for impregnating and casting large-volume components

This application relates to methods for the manufacture of leakage current-proof epoxy-resin molded materials from epoxy resin mixture based on di- or polycarboxylic-acid glycidyl esters, di- or polyfunctional cycloaliphatic olefinic epoxides and dicarboxylic-acid anhydrides, carried out in such a manner that molded materials with good mechanical properties are obtained also for parts of large volume. For this purpose, the invention provides that, by means of the experimentally determined time necessary to reach the maximum temperature during the cross-linking of the epoxy resin mixture under quasi adiabatic conditions, the rate of cross-linking of the epoxy resin mixture is adjusted, by the addition of a diol or polyol, to at least as long as the time necessary to reach the maximum temperature during cross-linking of the glycidyl ester/dicarboxylic acid anhydride components.

Method for manufacturing epoxy resin molded materials

Molding materials, laminates, stratified material and cover or protective layers which are of high electrical and mechanical quality are formed from polymerisable epoxy compounds if the corss-linking of the epoxy resins is accomplished by anionic polymerisation, using mixed catalysts of tertiary amines of the formula: ##STR1## and an imidazoles of the formula: ##STR2## as a polymerisation catalysts.

Method for the manufacture of epoxy resin molding materials

The invention relates to a method for manufacturing a hihg-tensile strength optical waveguide with a plastic layer of the epoxy-acrylate type located on the lightguide fiber, wherein a radiation-hardenable prepolymer is applied to the lightguide fiber immediately after the fiber-drawing process. The invention provides for the use in such a method of a preopolymer, which can be hardened by actinic radiation, of at least one acylated hydroxy ester of acrylic and/or methacrylic acid and an epoxide with n.ltoreq.3 epoxide groups per molecule. The optical waveguides manufactured by the method according the present invention are suitable particularly for purposes of optical information transmission.

Method for the manufacture of a high-tensile strength optical waveguide

The invention relates to agents for the surface treatment of flat insulating materials having a base of aromatic polyamides, and to a method for improving the surface characteristics of such flat insulating materials. According to the invention, such agents have the structure ##STR1## where at least one of the radicals R.sub.1 to R.sub.3 has a reactive group which can be incorporated into an impregnating resin system. Advantageously at least one of the radicals R.sub.1 to R.sub.3 has a reactive hydrogen atom or has an ethylenic or acetylenic unsaturated grouping.

Agent for the surface treatment of flat insulating materials

A light waveguide with a high tensile strength including a light conducting or optical fiber being coated with a plastic coating to improve the tensile strength characterized by the plastic coating being a plastic lacquer applied directly on the surface of the light conducting fiber, being a high temperature stable material selected from a group consisting of polyurethanes, epoxides, polyesters, polyesterimides, polyimides, and polyvinyl dimethoxymethane, which material has a softening temperature of at least 150.degree. C. The coating has a thickness of at least 2 .mu.m and is uniformly concentrically applied over the entire length of the light conducting fiber without any surface defects. The light waveguide may include an outer covering which is either tightly applied or loosely applied onto the light conducting fiber and its coating. To improve movement of the light conducting fiber and its coating in the covering, a slide layer may be interposed between the outer covering and the plastic lacquer coating.

Light waveguide with a high tensile strength

The invention provides epoxy resin casting compounds based on polyepoxides, polycarboxylic acids and/or polycarboxylic acid anhydrides with directly or latently present carboxyl functions, which can be converted by polyaddition and/or polymerization into insoluble and unmeltable cross-linked polymers. According to the invention, the carboxyl functions are replaced, at least partially, by maleic acid monoallyl ester and a polymerization-initiating radical former, the maleic acid monoallyl ester component being present in the reaction mixture in free form and/or in the form of adducts to the polyepoxide. The epoxy resin casting compounds constitute systems which can be processed in a wide temperature range and are cross-linked rapidly at elevated temperature.

Cross-linkable epoxy resin casting compounds

Lubricants for lacquered wires are provided comprising compounds of the type A-C-B, which compounds at room temperature have an ointment or soap-like consistency, wherein A is a chemical grouping containing reactive groups which permit chemical incorporation in a polymerizable impregnating resin system, B is a saturated or unsaturated aliphatic hydrocarbon radical, and C is a binding member in the form of a carbon, nitrogen, oxygen, or sulfur grouping. The lubricant is advantageously a 2,4-dienoxy-6-aminoalkyl (-ene)-s-triazine, particularly 2,4-dienoxy-6-aminostearyl-s-triazine. Such triazines are also useful according to another embodiment of the invention as lubricants for wire with enamel insulation.

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Nuremberg, Germany

Heinz Hacker