Texas Instruments Corporation

Texas Instruments Incorporated Deutschland, Gmbh

Heinrich Wachinger

Bernhard Peter Lange

Sebastian Meier

Stefan Fries

Hermann Bichler

Frank Mueller

Reinhard Hanzlik

In examples, a method of manufacturing a fluid sensing package comprises coupling a semiconductor die to a first set of conductive terminals; positioning the semiconductor die within a socket, a fluid probe extending through a probe orifice in a lid of the socket; positioning a ring of the fluid probe on a fluid sensing portion of the semiconductor die by closing the lid of the socket; and using the fluid probe to apply fluid to an area of the fluid sensing portion circumscribed by the ring.

Manufacturing fluid sensing packages

A wafer clamp assembly for holding a wafer during a deposition process comprises an outer annular member defining a central recess that has a diameter slightly greater than the diameter of the wafer. A plurality of finger members are carried by the outer annular member and extend radially inwardly from the outer annular member into the central recess, wherein each of the finger members has a free end for contacting the wafer during the deposition process.

Wafer clamp assembly for holding a wafer during a deposition process

Growing community of inventors

Helfenbrunn, Germany

Heinrich Wachinger