Atotech Deutschland Gmbh

Other

Schering Aktiengesellschaft

Atotech Duetschland Gmbh

Atotech Deutschalnd Gmbh

Man Diesel & Turbo Se

Heinrich Meyer

Gonzalo Urrutia Desmaison

Udo Grieser

Ralf Schulz

Walter J Meyer

Olaf Kurtz

Andreas Thies

Lutz Stamp

Ralph Herber

Wolfgang Scheel

Burkhard Bressel

Klaus Gedrat

Olaf Claussen

Konrad Cramer

Rosangela Pirri

Gilles Meunier

Walter Schmidt

Wolfgang Dahms

Franz Durst

Hartmut Mahlkow

Norbert Breuer

Herbert Reichl

Stefan Kretschmer

Franz Kohnle

Dieter Oesterhelt

Uwe Hauf

Stefan Fiedler

Francis Verzaro

Johannes Etzkorn

Christian Madry

Marjan Bele

Carsten Schwiekendick

Martin Kurpjoweit

Peter Prechtl

Sven Theisen

Heribert Streup

Eckart Klusmann

Jurgen-Otto Besenhard

Hans-Peter Gausmann

Andrea Ragge

Elisabeth Zettelmeyer

Jurgen Otto Besenhard

Michael Kuhlkamp

Waldfried J Plieth

Mathias Wunsche

J&uuml;rgen Otto Besenhard

Stane Pejovnik

Gunter Brenn

Michael Schafer

Theis Zur Nieden

Ewald Losert

Frank Rudolf

G&uuml;nter R&ouml;hrs

Hans-J&uuml;rg Barte

Gonzalo Urrutia Desmasion

Konrad Crämer

Wolfgang Friz

Roland Heinz

Oliver Ringtunatus

Thomas Tschinder

Thomas Vago

A method for joining microstructured component layers and a method for manufacturing microstructure component layers and the microstructure component layer is provided. At least one multifunctional barrier coating is applied to the joining surfaces of a base material layer for the microstructured component layers. The layers are made of aluminum/aluminum alloys and/or copper/copper alloys, and/or noble steels. At least one solder/brazing coating is applied to each barrier coating. The coated base material layers comprising the component layers are stacked. The stacked component layers are joined by solder/brazing using heat. The melting temperature of the solder/brazing coating is higher after the heat joining than before same.

Method of connecting module layers suitable for the production of microstructure modules and a microstructure module

A process for applying a metal layer to surfaces of light metals is proposed, in which iron is electrolytically deposited on the surfaces from a deposition bath containing Fe(II) compounds using dimensionally stable anodes insoluble in the deposition bath. The process is especially suitable for coating cylinder faces of internal combustion engines and of rotationally symmetrical parts with layers having very high wear resistance, especially of valves, nozzles and other parts of high-pressure injection systems for motor vehicle engines. In addition, the present invention pertains to nanocrystalline iron-phosphorus layers, which can be formed preferably by depositing iron in the presence of compounds containing orthophosphite and/or hypophosphite. These layers also have good corrosion resistance besides the good wear resistance.

Method for applying a metal layer to a light metal surface

The invention relates to a microstructure coolerfor an articleto be cooled, whereby the coolerincludes a stack of at least two metal filmsand one base platethat can be brought via a thermal contact surfaceinto thermal contact with the article, the metal filmsand the base plateare joined to one another in a material fit, present in the metal filmsare channelsfor cooling medium, and the channelshave a width in the range of 100 to 2,000 &#x3bc;m, a depth in the range of 25 to 1,000 &#x3bc;m, and a mean interval in the range of 50 to 1,000, residual film thicknesses resulting from the channelsin the metal filmsare in the range of 50 to 300 &#x3bc;m, and the base platehas a thickness in the range of 200 to 2,000 &#x3bc;m.

Microstructure cooler and use thereof

A method is disclosed for electrolytically forming conductor structures from highly pure copper on surfaces of semiconductor substrates, which surfaces are provided with recesses, when producing integrated circuits. The method includes the steps of coating the surfaces of the semiconductor substrates with a full-surface basic metal layer in order to achieve sufficient conductance for the electrolytic depositions, depositing full-surface deposition of copper layers of uniform layer thickness on the basic metal layer by an electrolytic metal deposition method, and structuring the copper layer. The electrolytic metal deposition method is accomplished by bringing the semiconductor substrates into contact with a copper deposition bath containing at least one copper ion source, at least one additive compound for controlling the physico-mechanical properties of the copper layers, and Fe(II) and/or Fe(III) compounds, and applying an electric voltage between the semiconductor substrates and dimensionally stable counter-electrodes.

Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits

Micro-components having at least one individual layer are produced according to the method, which have functional layers on the walls of inner structures, for example of flow channels. The micro-components are intended to be suitable for a large number of different applications in chemical reaction technology, for heat exchanging, for mixing substances or for evaporating liquids. In particular, the micro-components are intended to have no problems in respect of leaks in the flow channels. The method has the following method steps: A. producing the at least one individual layer by: a. producing a first metal layer or a metal foil ; b. forming the inner structures in and/or on the first metal layer or metal foil by suitable etching methods and/or metal deposition methods; and c. forming the functional layers solely on the walls of the inner structures and thereafter B. stacking up and joining the one individual layer to a segment terminating the inner structures, or a plurality of individual layers to one another and to the terminating segment.

Method for producing microcomponents

A process to pretreat copper surfaces for tight bonding to organic substrates as those found in multilayer printed circuit boards includes first treating the copper with a solution containing hydrogen peroxide, and at least one acid, and at least one nitrogen-containing five-member heterocyclic compound which does not contain sulfur, selenium or tellurium atoms in the heterocycle. Thereafter the copper surfaces are brought into contact with a second solution containing at least one adhesion-promoting compound from the group consisting of sufinic acid, selinic acid, telluric acid, and heterocyclic compounds that contain at least one sulfur, and/or selenium and/or tellurium atom in the heterocycie and also sulfonium, selenonium and telluronium salts.

Process for the preliminary treatment of copper surfaces

For manufacturing substrate materials which are needed for the manufacture of electrical circuit carriers, methods are known in which metal layers are applied to a dielectric substrate by means of a glow discharge process and thereafter additional metal layers are applied by means of electroplating processes. These methods however are not suitable for the manufacture of substrate materials which are suitable for high frequency applications in the gigahertz range. The invention starts from the previously-mentioned methods and solves the described problem through the use of fluoropolymers and through coating of these materials by means of a glow discharge process with nickel, since by this means even very smooth surfaces of the substrate can be securely coated. The metallised materials can be coated with additional metal layers from electroless or electrolytic deposition baths.

Method for producing metallized substrate materials

A method of reproducibly manufacturing circuit carriers with very fine circuit structures, more specifically with structure widths of 50 &mgr;m and less, is described in which a substrate provided with a base metal surface is provided, a layer of varnish is applied onto the substrate by an electrophoretic method, the layer of varnish is ablated in at least parts of the regions that do not correspond to the metal pattern to be formed, the base metal surface being laid bare, the bare base metal surface is etched, the layer of varnish being ablated by means of ultraviolet irradiation, more specifically with an ultraviolet laser beam.

Method for forming a metal pattern on a dielectric substrate

Solution and process to pretreat copper surfaces

The invention relates to photosensitive compositions, which can be developed positively. Traditional compositions have either inadequate photosensitivity or they are not appropriate for use on the copper surfaces, for example of circuit boards, since the exposed coating sections of the composition cannot be completely removed during developing, which results in problems in subsequent plating or etching. In the photosensitive compositions according to the invention, these disadvantages cannot be observed. Various compositions are described, which contain photo acid generators and a polymer resin with side groups, which can split acid, said polymer resin being formed by polymerizing at least three different acrylate- or methacrylate-monomers.

Photosensitive composition

Chemical microreactors for chemical systhesis and their methods of manufacture are known, but have disadvantages such as extremely high manufacturing costs or poor flexibility for adaptation to various cases of application. These disadvantages are avoided by means of the microreactors and manufacturing methods according to the invention. The microreactors are characterized in that the reactors contain fluid ducts in at least one plane as well as feed and return lines for fluids, wherein the fluid ducts are defined by side walls of metal opposing each other and further side walls of metal or plastic extending between said side walls, and in which the planes are connected together and/or with a closure segment closing open fluid ducts by means of appropriate solder or adhesive layers. The manufacturing method is characterized by process sequences in which the individual reactor planes produced by means of electrolytic methods, are connected together by soldering or gluing.

Chemical microreactors and method for producing same

A process for depositing metal coatings on polyimide surfaces for producing conductor tracks includes depositing a first metal coating by decomposition of volatile metal compounds by a glow discharge in a gas mixture containing inert gases and oxygen containing compounds, followed by electroless deposition of a second metal coating from an acid or neutral metallizing bath.

Process for plating metal coatings

The invention relates to a palladium colloid solution, which, in addition to a palladium compound, a protective colloid for stabilizing the colloid and a reducing agent, additionally contains noble metals from the group rhodium, iridium and platinum. The solution can be used to treat electrically non-conductive substrate surfaces, particularly in order to metallize the substrate surfaces directly and electrolytically. By means of this method, the nonconductive areas of the holes in printed circuit boards can be directly electrolytically metallized.

Palladium colloid solution and its utilization

The method for the manufacture of multilayer connecting substrates with multiple functions comprises the design of the connecting substrate taking place in functionally separated manner, in that signal conducting substrate parts (,), power supplying substrate parts (,), mechanical substrate parts (,), as well as the arrangement of components (,) or component-carrying substrate parts is separately planned and optimized as independent functions or modules and finally associated with spatially separated functional areas (inner/outer) of the overall circuit, the design taking place by the connection of the modules to an overall circuit embodying the connecting substrate. The resulting multilayer circuit with conductor network (,), components (,) and mechanical stiffening elements (,) has the following structure. The substrate parts with the fine, dense and flexible elements are associated with the inner areas of the overall circuit, the substrate parts with the rigid elements and/or components are associated with the outer areas of the overall circuit and a stiffening support material is so placed in the outer area that the circuit is given a mechanical support structure, which is designed in locally rigid manner passing into flexible areas. The overall circuit is folded and/or wound corresponding to the rigid and flexible portions. The mechanical support structure can be formed by separately produced apparatus housing parts or by the apparatus housing.

Connection substrate

Method and device for treating holes or recesses extending into workpieces with liquid treatment media

Growing community of inventors

Berlin, Germany

Heinrich Meyer