Williams Advanced Materials, Inc.

Materion Advanced Materials Technologies and Services Inc.

Heiner Lichtenberger

Derrick L Brown

Scott Haluska

Disclosed in this specification is a lead-free soldering alloy made of gold, tin and indium. The tin is present in a concentration of 17.5% to 20.5%, the indium is present in a concentration of 2.0% to 6.0% and the balance is gold and the alloy has a melting point between 290&#xb0; C. and 340&#xb0; C. and preferably between 300&#xb0; C. and 340&#xb0; C. The soldering alloy is particularly useful for hermetically sealing semiconductor devices since the melting temperature is sufficiently high to permit post-seal heating and sufficiently low to allow sealing of the semiconductor without causing damage.

Gold-tin-indium solder for processing compatibility with lead-free tin-based solder

An optical data recording and storage medium that includes a reflective layer formed from a silver alloy that contains, in addition to silver, about 0.2 to about 1.0 wt. %, based on the total weight of alloy, of samarium (Sm), about 0.2 to about 2.0 wt. % of copper (Cu), about 0.1 to about 0.3 wt. % of titanium (Ti), and about 0.2 to about 0.8 wt .% of manganese (Mn).

Silver-reactive metal alloys for optical data storage and recordable storage media containing same

A method of making an integral plated and solder clad cover lid for electronic packages is disclosed. The cover lid is plated and or clad with a first corrosion resistant and solderable material and is clad with a solder material on one side. The cladded substrate is stamped and then plated with a second corrosion resistant and solderable material. The second material is subsequently sintered and preferentially diffused into the solder material resulting in a visual distinction between the solder side of the cover lid and the backing side.

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Williamsville, NY, United States of America

Heiner Lichtenberger